Asus S62F - page 24

Disassembly procedure

11. Separate the LCD module from the Top Case module

12. Remove 2 screws (M2.5*4L (K)) and take away the LANCH board.

TOP

CASE

REMOVAL

M2.5*4L

13. Remove the LANCH board cable.

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Contents

Main Service Overview T S62F Series Overview and Components S62F Ov erview Page Components Page Page Page Page Page Service Overview Precautions Appropriate Tools Disassembly Procedure A Ba ttery Module HDD Module Wireless LAN Module Memory Module CPU Module Unlock ODD Module Keyboard Top Case Module Page Page Inverter & camera cable Antenna Page Page Motherboard Bluetooth cable S p eaker cable Page Bottom Case Module L CD Module Page Page Page Page Page Assembly Procedure A L CD Module Page Page Page Page Bottom Case Module Motherboard Page Bluetooth cable S p eaker cable Top Case Module Page Page Inverter & camera cable Antenna Page Page Assembling K eyboard ODD Module CPU Module Assembly Loc k Assembling Memory Module Wireless LAN Module HDD Module Ba ttery Module Upgrade & Replacement A CPU Upgrade Page Unlock Loc k Page Second Memory Upgrade Page Page HDD Upgrade Page Page Page Page Page ODD R eplacement Page Page HARDWARE SPECIFICATION T Hardware Specifications HARDWARE SPECIFICATION 1 MARKETING SPEC S62F Specification (Two-Spindle Design) Page Page Page Page Page Page 2 CHIPSET LIST 2.1 CPU 2.2 CHIPSET 2.2.1 North Bridge 2.2.2 South Bridge IRQ Controller 2.4 BIOS ROM 2.5 INTERNAL VGA CONTROLLER 2.6 I/O INTERFACE Controller 2.7 PCMCIA Controller 2.8 KEYBOARD CONTROLLER 2.9 AUDIO CODEC 2.10 AUDIO AMPLIFIER 2.11 LAN & MODEM 2.11.1 LAN 2.11.2 MODEM 3 KEY PARTS LIST Page Page 3.1 Display 3.2 Hard Disk Drive 3.3 Combo Drive 3.4 DVD-Dual Drive 3.5 Touch Pad 3.6 Keyboard 3.7 Battery 3.7.1 Main Battery 3.8 AC/DC Adapter Page Page 4.2 Main components block diagrams 4.3 System resource 4.3.1 IRQ Map 4.3.2 ISA DMA Map 4.3.3 PCI INT Map 4.3.4 PCI Bus Master Map 4.3.5 IDSEL 5 I/O PORT PIN ASSIGNMENT 5.1 CRT Page 5.2 Hard disk pin assignment 5.3 ODD pin assignment Page 5.4 LCD pin assignment Page 5.5 Internal keyboard pin assignment 5.6 Internal Touch Pad Pin assignment 5.7 1ST Battery pin assignment 5.8 DC in Jack pin assignment 5.9 Audio Jack 5.9.1 Internal Speaker Jack 5.9.2 Headphone Jack 5.9.3 Microphone Jack 5.10 Fan Pin Assignment 5.11 Inverter pin assignment 5.12 MDC signal 5.13 1394 pin assignment 5.14 USB pin assignment 5.15 LAN & Modem pin assignment 5.16 Card Reader pin assignment 6 POWER MANAGEMENT 6.1 System power plane 6.2 Power management mode 6.2.1 Full-On mode 6.2.2 Doze mode 6.2.3 Stand by mode 6.2.4 Suspend to RAM mode (STR) Page 6.3.1 Lid switch 6.3.2 Power button 6.4 Device Power management Page 6.4.1 Device PM control during Stand By mode 6.4.2 Device PM control during STR mode 6.4.3 Device PM control during STD mode 7 MODULE SPECIFICATION 7.1 Overall System 7.1.1 Board assembly 7.2 Processor 7.3 Main board 7.3.1 Main system module spec 7.3.2 DC/DC module spec 7.3.3 Charger 7.4 Inverter Board 7.5 Adapter spec 7.5.1 Input 7.5.2 Output 7.5.3 Protection 7.6 Main Battery spec 7.7 LAN Spec 7.8 Modem spec 8 MISCELLANEOUS 8.1 Indicators 8.2 Power cord list 8.3 Safety/ EMI Appliance (TBD): T Softw ar e Specifica tions Chapter 1. General Description 2. Summary of Hardware Configuration 2.3.2 PCI Devices Vendor/Device IDs and Sub-System/Vendor IDs Page 3. Summary of BI OS Requirements 4. BIOS Features 4.4 SUPER I/O Page Page Page Page Page 5. GPIO Pin Assignment Page Page Page Page 6. Devices Page Page Page 7. CMOS Setup Utility Page Page Page 7.3 SECURITY MENU: 7.4 POWER MENU: 7.5 BOOT MENU: 7.6 EXIT MENU: Page 9. Embedded Controller (EC) 9.2 INSTANT KEYS 9.3.2 Internet Key