4. Remove the fan/heat sink assembly (3).
NOTE: Due to the adhesive quality of the thermal paste and thermal pads located between the fan/heat sink assembly and system board components, it may be necessary to move the fan/heat sink assembly from side to side to detach the assembly.
NOTE: The thermal paste and thermal pads should be thoroughly cleaned from the surfaces of the fan/heat sink assembly (1), (2), and (3), the system board components (4) and (6), and the processor (5) each time the fan/heat sink assembly is removed. Thermal pads and thermal paste should be applied to all surfaces before the fan/heat sink assembly is reinstalled. Thermal pads and thermal paste are included with all fan/heat sink assembly, system board, and processor spare part kits.
