CY62146EV30 MoBL®
Document #: 38-05567 Rev. *C Page 4 of 12
Capacitance (For All Packages) [9]
Parameter Description Test Conditions Max Unit
CIN Input Capacitance TA = 25°C, f = 1 MHz,
VCC = VCC(typ)
10 pF
COUT Output Capacitance 10 pF
Thermal Resistance [9]
Parameter Description Test Conditions
VFBGA
Package
TSOP II
Package Unit
ΘJA Thermal Resistance
(Junction to Ambient)
Still Air, soldered on a 3 × 4.5 inch,
two-layer printed circuit board
75 77 °C/W
ΘJC Thermal Resistance
(Junction to Case)
10 13 °C/W

AC Test Loads and Waveforms

Parameters 2.50V 3.0V Unit
R1 16667 1103 Ω
R2 15385 1554 Ω
RTH 8000 645 Ω
VTH 1.20 1.75 V
Data Retention Characteristics (Over the Operating Range)
Parameter Description Conditions Min Typ [2] Max Unit
VDR VCC for Data Retention 1.5 V
ICCDR [8] Data Retention Current VCC = 1.5V, CE > VCC – 0.2V,
VIN > VCC – 0.2V or VIN < 0.2V
0.8 7 µA
tCDR [9] Chip Deselect to Data Retention Time 0 ns
tR [10] Operation Recovery Time tRC ns

Data Retention Waveform

VCC
VCC
OUTPUT
R2
30 pF
INCLUDING
JIG AND
SCOPE
GND
90%
10%
90%
10%
Rise Time = 1 V/ns Fal l Time = 1 V/ns
OUTPUT V
ALL INPUT PULSES
RTH
R1
Equivalent to: THEVENIN EQUIVALENT
VCC(min)
VCC(min)
tCDR
VDR>1.5V
DATA RETENTION MODE
tR
VCC
CE
Notes:
9. Tested initially and after any design or process changes that may affect these parameters.
10.Full device operation requires linear VCC ramp from VDR to VCC(min) > 100 µs or stable at VCC(min) > 100 µs.