CY62148E MoBL®
Document #: 38-05442 Rev. *F Page 4 of 10
Thermal Resistance [10]
Parameter Description Test Conditions SOIC
Package
TSOP II
Package Unit
ΘJA Thermal Resistance
(Junction to Ambient)
Still Air, soldered on a 3 × 4.5 inch,
two-layer printed circuit board
75 77 °C/W
ΘJC Thermal Resistance
(Junction to Case)
10 13 °C/W
AC Test Loads and Waveforms
Parameters 5.0V Unit
R1 1800 Ω
R2 990 Ω
RTH 639 Ω
VTH 1.77 V
Data Retention Characteristics (Over the Operating Range)
Parameter Description Conditions Min Typ [3] Max Unit
VDR VCC for Data Retention 2 V
ICCDR Data Retention Current VCC= VDR, CE > VCC – 0.2V,
VIN > VCC – 0.2V or VIN < 0.2V
Ind’l/Auto-A 1 7 µA
tCDR [10] Chip Deselect to Data Retention Time 0 ns
tR [11] Operation Recovery Time tRC ns
Data Retention Waveform
3.0V
VCC
OUTPUT
R2
30 pF
INCLUDING
JIG AND
SCOPE
GND
90%
10%
90%
10%
Rise Time = 1 V/ns Fall Time = 1 V/ns
OUTPUT V
Equivalentto: THEVENIN EQUIVALENT
ALL INPUT PULSES
RTH
R1
VCC(min)
VCC(min)
tCDR
VDR>2.0V
DATA RETENTION MODE
tR
VCC
CE
Note
11.Full device operation requires linear VCC ramp from VDR to VCC(min) > 100 µs or stable at VCC(min) > 100 µs.
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