Cypress CY62157CV30, CY62157CV33 Electrical Characteristics , Thermal Resistance

CY62157CV30/33
Document #: 38-05014 Rev. *F Page 4 of 13
Electrical Characteristics Over the Operating Range
Parameter Description Test Conditions
CY62157CV33-70
UnitMin. Typ.[2] Max.
VOH Output HIGH
Voltag e IOH = –1.0 mA VCC = 3.0V 2.4 V
VOL Output LOW
Voltag e IOL = 2.1 mA VCC = 3.0V 0.4 V
VIH Input HIGH Voltage 2.2 VCC + 0.3V V
VIL Input LOW Voltage –0.3 0.8 V
IIX Input Leakage
Current GND < VI < VCC Auto-A –1 +1 µA
Auto-E –10 +10 µA
IOZ Output Leakage
Current GND < VO < VCC, Output Disabled Auto-A –1 +1 µA
Auto-E –10 +10 µA
ICC VCC Operating
Supply
Current
f = fMAX = 1/tRC VCC = 3.6V
IOUT = 0 mA
CMOS Levels
Auto-A 5.5 12 mA
Auto-E 7 15
f = 1 MHz Auto-A/
Auto-E 1.5 3
ISB1 Automatic CE
Power-Down
Current—CMOS
Inputs
CE1 > VCC – 0.2V or
CE2 < 0.2V
VIN > VCC – 0.2V or
VIN < 0.2V,
f = fmax (Address and Data
Only),
f = 0 (OE,WE,BHE,and BLE)
Auto-A 10 30 µA
Auto-E 10 80 µA
ISB2 Automatic CE
Power-Down
Current—CMOS
Inputs
CE1 > VCC – 0.2V or
CE2 < 0.2V
VIN > VCC – 0.2V or
VIN < 0.2V,
f = 0, VCC = 3.6V
Auto-A 10 30 µA
Auto-E 10 80 µA
Thermal Resistance[7]
Parameter Description Test Conditions FBGA Unit
ΘJA Thermal Resistance
(Junction to Ambient) Still Air, soldered on a 3 x 4.5 inch, two-layer printed circuit board 55 °C/W
ΘJC Thermal Resistance
(Junction to Case) 16 °C/W
Note:
7. Tested initially and after any design or process changes that may affect these parameters.
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