CY62157EV18 MoBL®
Document #: 38-05490 Rev. *D Page 4 of 12
Thermal Resistance [8]
Parameter Description Test Conditions BGA Unit
ΘJA Thermal Resistance
(Junction to Ambient)
Still air, soldered on a 3 × 4.5 inch,
two-layer printed circuit board
72 °C/W
ΘJC Thermal Resistance
(Junction to Case)
8.86 °C/W
AC Test Loads and WaveformsParameters Value Unit
R1 13500 Ω
R2 10800 Ω
RTH 6000 Ω
VTH 0.80 V
Data Retention Characteristics (Over the Operating Range)
Parameter Description Conditions Min Typ [2] Max Unit
VDR VCC for Data Retention 1.0 V
ICCDR Data Retention Current VCC= VDR, CE1 > VCC – 0.2V,
CE2 < 0.2V,VIN > VCC – 0.2V or VIN < 0.2V
13µA
tCDR [8] Chip Deselect to Data Retention Time 0 ns
tR [9] Operation Recovery Time tRC ns
Data Retention Waveform [10]
3V
VCC
OUTPUT
R2
30 pF
INCLUDING
JIG AND
SCOPE
GND
90%
10%
90%
10%
Rise Time = 1 V/ns Fall Time = 1 V/ns
OUTPUT V
Equivalent to: THEVENIN EQUIVALENT
ALL INPUT PULSES
RTH
R1
VCC(min)
tCDR
VDR >1.0V
DATA RETENTION MODE
tR
VCC(min)
CE1 or
VCC
BHE.BLE
CE
2
or
Notes
9. Full device operation requires linear VCC ramp from VDR to VCC(min) > 100 µs or stable at VCC(min) > 100 µs.
10.BHE.BLE is the AND of both BHE and BLE. Deselect the chip by either disabling chip enable signals or by disabling both BHE and BLE.
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