CY62157EV30 MoBL®
Document #: 38-05445 Rev. *E Page 2 of 14
Product Portfolio
Product Range
VCC Range (V) Speed
(ns)
Power Dissipation
Operating ICC, (mA) Standby, ISB2
(µA)
f = 1MHz f = fmax
Min Typ [2] Max Typ [2] Max Typ [2] Max Typ [2] Max
CY62157EV30LL Ind’l/Auto-A 2.2V 3.0 3.6 45 1.8 3 18 25 2 8
Pin Configuration
The following pictures show the 44-pin TSOP II and 48-pin TSOP I pinouts.[3, 4, 5]
1
2
3
4
5
6
7
8
9
11
14 31
32
36
35
34
33
37
40
39
38
12
13
41
44
43
42
16
15
29
30
18
17
20
19
27
28
25
26
22
21
23
24
10
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
A15
A14
A13
A12
A11
A10
A9
A8
NC
DNU
WE
CE2
DNU
BHE
BLE
A18
A17
A7
A6
A5
A4
A3
A2
A1
A16
BYTE
Vss
IO15/A19
IO7
IO14
IO6
IO13
IO5
IO12
IO4
Vcc
IO11
IO3
IO10
IO2
IO9
IO1
IO8
IO0
OE
Vss
CE1
A0
A
5
44-Pin TSOP II
Top View
A
6
A
7
A
4
A
3
A
2
A
1
A
0
A
17
A
18
A
9
A
10
A
11
A
12
A
15
A
16
A
14
A
13
OE
BHE
BLE
CE
WE
IO
0
IO
1
IO
2
IO
3
IO
4
IO
5
IO
6
IO
7
IO
8
IO
9
IO
10
IO
11
IO
12
IO
13
IO
14
IO
15
V
CC
V
CC
V
SS
V
SS
A
8
48-Pin TSOP I (512K x 16 / 1M x 8)
Top Vie w
Notes
2. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at VCC = VCC(typ), TA = 25°C.
3. NC pins are not connected on the die.
4. The 44-TSOP II package has only one chip enable (CE) pin.
5. The BYTE pin in the 48-TSOP I package has to be tied HIGH to use the device as a 512K × 16 SRAM. The 48-TSOP I package can also be used as a 1M × 8
SRAM by tying the BYTE signal LOW. In the 1M x 8 configuration, Pin 45 is A19, while BHE, BLE and IO8 to IO14 pins are not used (DNU).
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