CY62157EV30 MoBL®
Document #: 38-05445 Rev. *E Page 5 of 14
Thermal Resistance [10]
Parameter Description Test Conditions BGA TSOP I TSOP II Unit
ΘJA Thermal Resistance
(Junction to Ambient)
Still Air, soldered on a 3 × 4.5 inch,
two-layer printed circuit board
72 74.88 76.88 °C/W
ΘJC Thermal Resistance
(Junction to Case)
8.86 8.6 13.52 °C/W
AC Test Loads and Waveforms
Figure 1. AC Test Loads and Waveforms
Parameters 2.5V 3.0V Unit
R1 16667 1103 Ω
R2 15385 1554 Ω
RTH 8000 645 Ω
VTH 1.20 1.75 V
VCC
VCC
OUTPUT
R2
30 pF
INCLUDING
JIG AND
SCOPE
GND
90%
10% 90%
10%
Rise Time = 1 V/ns Fall Time = 1 V/ns
OUTPUT V
Equivalent to: THÉ VENIN EQUIVALENT
ALL INPUT PULSES
RTH
R1
TH
Data Retention Characteristics
Over the Operating Range
Parameter Description Conditions Min Typ [2] Max Unit
VDR VCC for Data Retention 1.5 V
ICCDR [9] Data Retention Current VCC= 1.5V, CE1 > VCC – 0.2V,
CE2 < 0.2V, VIN > VCC – 0.2V or VIN < 0.2V
Ind’l/Auto-A 2 5 µA
tCDR [10] Chip Deselect to Data
Retention Time 0ns
tR [11] Operation Recovery Time tRC ns
Data Retention Waveform[12]
Figure 2. Data Retention Waveform
VCC(min)
tCDR
VDR >1.5V
DATA RETENTION MODE
tR
VCC(min)
CE1 or
VCC
BHE.BLE
CE
2
or
Notes
11.Full device operation requires linear VCC ramp from VDR to VCC(min) > 100 µs or stable at VCC(min) > 100 µs.
12.BHE.BLE is the AND of both BHE and BLE. Deselect the chip by either disabling chip enable signals or by disabling both BHE and BLE.
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