Cypress CY62157EV30 Thermal Resistance, AC Test Loads and Waveforms, Data Retention Waveform12

CY62157EV30 MoBL®

Thermal Resistance [10]

Parameter	Description	Test Conditions	BGA	TSOP I	TSOP II	Unit
ΘJA	Thermal Resistance	Still Air, soldered on a 3 × 4.5 inch,	72	74.88	76.88	°C/W
	(Junction to Ambient)	two-layer printed circuit board
ΘJC	Thermal Resistance		8.86	8.6	13.52	°C/W
	(Junction to Case)

AC Test Loads and Waveforms

Figure 1. AC Test Loads and Waveforms

R1

VCC

OUTPUT

30 pF

INCLUDING

JIG AND

SCOPE

VCC		ALL INPUT PULSES
					90%
10%		90%				10%
GND						Fall Time = 1 V/ns
R2 Rise Time = 1 V/ns
Equivalent to:			THÉVENIN EQUIVALENT
				RTH
	OUTPUT						V TH

Parameters	2.5V	3.0V	Unit
R1	16667	1103	Ω
R2	15385	1554	Ω
RTH	8000	645	Ω
VTH	1.20	1.75	V

Data Retention Characteristics

Over the Operating Range

Parameter	Description		Conditions		Min	Typ [2]	Max	Unit
VDR	VCC for Data Retention				1.5			V
[9]	Data Retention Current	VCC= 1.5V, CE1 > VCC – 0.2V,		Ind’l/Auto-A		2	5	∝A
ICCDR
		CE2 < 0.2V, VIN > VCC – 0.2V or VIN < 0.2V
tCDR [10]	Chip Deselect to Data				0			ns
	Retention Time
t [11]	Operation Recovery Time				t			ns
R					RC

Data Retention Waveform[12]

Figure 2. Data Retention Waveform

VCC

CE1 or

BHE.BLE or

CE2

VCC(min) tCDR

DATA RETENTION MODE

VDR > 1.5V

VCC(min)

tR

Notes

11.Full device operation requires linear VCC ramp from VDR to VCC(min) > 100 ∝s or stable at VCC(min) > 100 ∝s.

12.BHE.BLE is the AND of both BHE and BLE. Deselect the chip by either disabling chip enable signals or by disabling both BHE and BLE.

Document #: 38-05445 Rev. *E Page 5 of 14

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