Intel 80960HD, 80960HT, 80960HA manual Maximum TA at Various Airflows in C PQ4 Package Only, 400

80960HA/HD/HT

Table 14. Maximum TA at Various Airflows in ° C (PQ4 Package Only)

					Airflow-ft/min (m/sec)
		fCLKIN	0	200	400	600	800	1000
		(MHz)	(0)	(1.01)	(2.03)	(3.04)	(4.06)	(5.07)
	TA with	25	71	76	79	79	80	80
		33	67	74	77	77	79	79
Core	Heatsink†
		40	63	71	75	75	77	77
1X Bus
	TA	25	70	73	75	75	76	76
Clock
	without	33	65	68	72	72	74	74
	Heatsink	40	61	65	69	69	71	71
	TA with	16	71	76	79	79	80	80
		25	62	71	75	75	77	77
Core	Heatsink†	33	55	66	71	71	74	74
		40	48	62	68	68	72	72
2X Bus
		16	69	72	75	75	76	76
Clock	TA
		25	60	64	68	68	71	71
	without	33	52	57	63	63	66	66
	Heatsink
		40	42	51	58	58	62	62
	TA with	20	58	68	73	73	76	76
Core	Heatsink†	25	51	64	70	70	73	73
3X Bus	TA	20	56	61	66	66	68	68
Clock
	without
		25	48	55	61	61	64	64
	Heatsink

† 0.285” high unidirectional heatsink (AI alloy 6061, 50 mil fin width, 150 mil center-to-center fin spacing).

Table 15. 80960Hx 208-Pin PQ4 Package Thermal Characteristics

Thermal Resistance — ° C/Watt

		Airflow — ft./min (m/sec)
Parameter
	0	200	400	600	800	1000
	(0)	(1.01)	(2.03)	(3.07)	(4.06)	(5.07)
θ Junction-to-Case
(Case measured as	1	1	1	1	1	1
shown in Figure 5.)
θ Case-to-Ambient	12	10	8	8	7	7
(No Heatsink)
θ Case-to-Ambient	11	7	5	5	4	4
(With Heatsink)3

θJA

θ JC

NOTES:

1.This table applies to 80960Hx PQ4 plugged into socket or soldered directly to board.

2.θ JA = θ JC + θ CA

3.0.285” high unidirectional heatsink (AI alloy 6061, 50 mil fin width, 150 mil center-to-center fin spacing).

Datasheet 33