Intel 80960HA Maximum TA at Various Airflows in C PGA Package Only, Airflow-ft/min m/sec, 600

80960HA/HD/HT

Table 12. Maximum TA at Various Airflows in ° C (PGA Package Only)

					Airflow-ft/min (m/sec)
		fCLKIN	0	200	400	600	800	1000
		(MHz)	(0)	(1.01)	(2.03)	(3.04)	(4.06)	(5.07)
	TA with	25	69	74	78	79	80	80
		33	63	70	75	77	79	79
Core	Heatsink†
		40	59	67	73	75	77	77
1X Bus
	TA	25	64	67	71	74	75	76
Clock
	without	33	56	62	67	70	72	74
	Heatsink	40	50	56	63	67	69	71
	TA with	16	68	73	77	79	80	80
		25	58	66	73	75	77	77
Core	Heatsink†	33	49	60	69	71	74	74
		40	41	55	65	68	72	72
2X Bus
		16	62	66	71	73	75	76
Clock	TA
		25	49	56	62	66	68	71
	without	33	38	46	55	60	63	66
	Heatsink
		40	27	38	48	55	58	62
	TA with	20	53	63	71	73	76	76
Core	Heatsink†	25	45	58	67	70	73	73
3X Bus	TA	20	43	51	58	63	66	68
Clock
	without
		25	33	42	51	58	61	64
	Heatsink

† *0.285” high unidirectional heatsink (AI alloy 6061, 50 mil fin width, 150 mil center-to-center fin spacing).

Table 13. 80960Hx 168-Pin PGA Package Thermal Characteristics

Thermal Resistance — ° C/Watt

		Airflow — ft./min (m/sec)
Parameter
	0	200	400	600	800	1000
	(0)	(1.01)	(2.03)	(3.07)	(4.06)	(5.07)
θ Junction-to-Case
(Case measured as	1.5	1.5	1.5	1.5	1.5	1.5
shown in Figure 5.)
θ Case-to-Ambient	17	14	11	9	8	7
(No Heatsink)
θ Case-to-Ambient	13	9	6	5	4	4
(With Heatsink)3

θJA

θ JC

NOTES:

1.This table applies to 80960Hx PGA plugged into socket or soldered directly to board.

2.θ JA = θ JC + θ CA

3.0.285” high unidirectional heatsink (AI alloy 6061, 50 mil fin width, 150 mil center-to-center fin spacing).

32 Datasheet