CY7C1218H

Maximum Ratings

(Above which the useful life may be impaired. For user guide- lines, not tested.)

Storage Temperature

–65°C to + 150°C

Ambient Temperature with

 

 

Power Applied

–55°C to + 125°C

Supply Voltage on VDD Relative to GND

–0.5V to + 4.6V

Supply Voltage on VDDQ Relative to GND

–0.5V to + VDD

DC Voltage Applied to Outputs

 

 

in Tri-State

–0.5V to VDDQ + 0.5V

Electrical Characteristics Over the Operating Range [8, 9]

DC Input Voltage

–0.5V to VDD + 0.5V

Current into Outputs (LOW)

 

20 mA

Static Discharge Voltage

 

>2001V

(per MIL-STD-883, Method 3015)

 

Latch-up Current

 

>200 mA

Operating Range

 

 

 

 

 

 

 

Ambient

 

 

Range

Temperature

VDD

VDDQ

Commercial

0°C to +70°C

3.3V –5%/+10%

2.5V –5%

 

 

 

to VDD

Industrial

–40°C to +85°C

 

Parameter

Description

Test Conditions

Min.

Max.

Unit

VDD

Power Supply Voltage

 

 

3.135

3.6

V

VDDQ

I/O Supply Voltage

for 3.3V I/O

 

3.135

VDD

V

 

 

for 2.5V I/O

 

2.375

2.625

V

 

 

 

 

 

 

 

VOH

Output HIGH Voltage

for 3.3V I/O, IOH = –4.0 mA

 

2.4

 

V

 

 

for 2.5V I/O, IOH = –1.0 mA

 

2.0

 

V

VOL

Output LOW Voltage

for 3.3V I/O, IOL = 8.0 mA

 

 

0.4

V

 

 

for 2.5V I/O, IOL = 1.0 mA

 

 

0.4

V

VIH

Input HIGH Voltage[8]

for 3.3V I/O

 

2.0

VDD + 0.3V

V

 

 

for 2.5V I/O

 

1.7

VDD + 0.3V

V

VIL

Input LOW Voltage[8]

for 3.3V I/O

 

–0.3

0.8

V

 

 

for 2.5V I/O

 

–0.3

0.7

V

 

 

 

 

 

 

 

IX

Input Leakage Current

GND VI VDDQ

 

–5

5

A

 

except ZZ and MODE

 

 

 

 

 

 

Input Current of MODE

Input = VSS

 

–30

 

A

 

 

Input = VDD

 

 

5

A

 

Input Current of ZZ

Input = VSS

 

–5

 

A

 

 

Input = VDD

 

 

30

A

IOZ

Output Leakage Current

GND VI VDDQ, Output Disabled

–5

5

A

IDD

VDD Operating Supply

VDD = Max., IOUT = 0 mA,

6-ns cycle, 166 MHz

 

240

mA

 

Current

f = fMAX = 1/tCYC

 

 

 

 

 

7.5-ns cycle, 133 MHz

 

225

mA

ISB1

Automatic CS

VDD = Max, Device Deselected,

6-ns cycle, 166 MHz

 

100

mA

 

Power-down

VIN VIH or VIN VIL

 

 

 

 

 

7.5-ns cycle, 133 MHz

 

90

mA

 

Current—TTL Inputs

f = fMAX = 1/tCYC

 

 

 

 

ISB2

Automatic CS

VDD = Max, Device Deselected,

All speeds

 

40

mA

 

Power-down

VIN 0.3V or VIN > VDDQ – 0.3V,

 

 

 

 

 

Current—CMOS Inputs

f = 0

 

 

 

 

ISB3

Automatic CS

VDD = Max, Device Deselected,

6-ns cycle, 166 MHz

 

85

mA

 

Power-down

or VIN 0.3V or VIN > VDDQ – 0.3V

 

 

 

 

 

7.5-ns cycle, 133 MHz

 

75

mA

 

Current—CMOS Inputs

f = fMAX = 1/tCYC

 

 

 

 

ISB4

Automatic CS

VDD = Max, Device Deselected,

All speeds

 

45

mA

 

Power-down

VIN VIH or VIN VIL, f = 0

 

 

 

 

 

Current—TTL Inputs

 

 

 

 

 

Notes:

8.Overshoot: VIH(AC) < VDD +1.5V (Pulse width less than tCYC/2), undershoot: VIL(AC) > –2V (Pulse width less than tCYC/2).

9.TPower-up: Assumes a linear ramp from 0V to VDD(min.) within 200 ms. During this time VIH < VDD and VDDQ < VDD.

Document #: 38-05667 Rev. *B

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Cypress CY7C1218H manual Maximum Ratings, Operating Range, Ambient Range, Description Test Conditions Min Max Unit

CY7C1218H specifications

The Cypress CY7C1218H is a high-performance synchronous static random-access memory (SRAM) device designed to meet the demanding requirements of advanced memory applications. This SRAM boasts a density of 2 Mbits, making it suitable for a variety of uses, including telecommunications, industrial, and consumer electronics.

One of the main features of the CY7C1218H is its fast access time, which ranges from 10 ns to 15 ns, depending on the specific configuration. This high-speed access allows for efficient read/write operations and ensures that the memory can keep pace with the needs of high-speed processors and data buses. The device operates with a single 3.3V supply, enhancing its compatibility with modern digital circuits and reducing power consumption.

The CY7C1218H employs a synchronous interface that simplifies the control signaling process and increases data transfer rates. This synchronous nature means that the operation of the chip is synchronized with an external clock, facilitating faster and more reliable data transfer between the memory and the host system. This is particularly beneficial in high-performance applications where latency and throughput are critical.

In addition to its speed and efficiency, the CY7C1218H features a low standby power mode. This is an essential characteristic for battery-powered and energy-efficient systems, as it significantly reduces power consumption when the device is not actively in use. The SRAM design also includes a write protect feature, enhancing data integrity and security in sensitive applications.

The device is packaged in a 44-pin TSOP (Thin Small Outline Package) and has a compact footprint, making it suitable for space-constrained designs. The CY7C1218H uses advanced CMOS technology to support reliable performance and long data retention, ensuring that stored data remains intact even during power-down cycles.

Overall, the Cypress CY7C1218H represents a robust solution for engineers looking to integrate high-speed, low-power SRAM into their designs. Its blend of speed, reliability, and efficiency makes it an excellent choice for applications requiring fast access and secure data storage, making it a staple in various electronic systems across different industries.