Cypress CY7C1303BV25, CY7C1306BV25 manual Maximum Ratings, Operating Range, Thermal Resistance

CY7C1303BV25

CY7C1306BV25

Maximum Ratings

(Above which the useful life may be impaired.)

Storage Temperature		–65°C to + 150°C
Ambient Temperature with
Power Applied		–55°C to + 125°C
Supply Voltage on VDD Relative to GND		–0.5V to + 3.6V
Supply Voltage on VDDQ Relative to GND		–0.5V to + VDD
DC Applied to Outputs in
High-Z State	–0.5V to VDDQ + 0.5V

Electrical Characteristics Over the Operating Range[14] DC Electrical Characteristics Over the Operating Range

DC Input Voltage[17]			–0.5V to VDD + 0.5V
Current into Outputs (LOW)					20 mA
Static Discharge Voltage					> 2001V
(per MIL-STD-883, Method 3015)
Latch-up Current				> 200 mA
Operating Range
Range	Ambient	V	[13]	V	[13]
	Temperature (T )
	A		DD		DDQ
Com’l	0°C to + 70°C	2.5 ± 0.1V		1.4V to 1.9V
Ind’l	–40°C to + 85°C

Parameter			Description		Test Conditions	Min.	Typ.		Max.	Unit
VDD		Power Supply Voltage				2.4	2.5		2.6	V
VDDQ		I/O Supply Voltage				1.4	1.5		1.9	V
VOH		Output HIGH Voltage		Note 15		VDDQ/2 – 0.12			VDDQ/2 + 0.12	V
VOL		Output LOW Voltage		Note 16		VDDQ/2 – 0.12			VDDQ/2 + 0.12	V
VOH(LOW)		Output HIGH Voltage		IOH = –0.1 mA, Nominal Impedance		VDDQ – 0.2			VDDQ	V
VOL(LOW)		Output LOW Voltage		IOL = 0.1 mA, Nominal Impedance		VSS			0.2	V
VIH		Input HIGH Voltage[17]				VREF + 0.1			VDDQ + 0.3	V
VIL		Input LOW Voltage[17, 18]				–0.3			VREF – 0.1	V
VREF		Input Reference Voltage[19]		Typical value = 0.75V		0.68	0.75		0.95	V
IX		Input Leakage Current		GND ≤ VI ≤ VDDQ		–5			5	∝A
IOZ		Output Leakage Current		GND ≤ VI ≤ VDDQ, Output Disabled		–5			5	∝A
IDD		VDD Operating Supply		VDD = Max., IOUT = 0 mA,					500	mA
				f = fMAX = 1/tCYC
ISB1		Automatic		Max. VDD, Both Ports Deselected,					240	mA
		Power-Down		VIN ≥ VIH or VIN ≤ VIL f = fMAX =1/tCYC,
		Current		Inputs Static
AC Input	Requirements Over the Operating Range
Parameter			Description		Test Conditions	Min.	Typ.		Max.	Unit
VIH		Input HIGH Voltage				VREF + 0.2	–		–	V
VIL		Input LOW Voltage				–	–		VREF – 0.2	V
Thermal Resistance[20]
Parameter			Description		Test Conditions		165 FBGA Package			Unit
ΘJA			Thermal Resistance		Test conditions follow standard test methods and			16.7		°C/W
			(Junction to Ambient)		procedures for measuring thermal impedance,
					per EIA/JESD51.
ΘJC			Thermal Resistance					6.5		°C/W
			(Junction to Case)
Notes:

13.Power-up: Assumes a linear ramp from 0V to VDD(min.) within 200 ms. During this time VIH < VDD and VDDQ < VDD.

14.All Voltage referenced to Ground.

15.Output are impedance controlled. IOH = –VDDQ/2)/(RQ/5) for values of 175Ω <= RQ <= 350Ω.

16.Output are impedance controlled. IOL = (VDDQ/2)/(RQ/5) for values of 175Ω <= RQ <= 350Ω.

17.Overshoot: VIH(AC) < VDDQ +0.85V (Pulse width less than tCYC/2), Undershoot: VIL(AC) > –1.5V (Pulse width less than tCYC/2).

18.This spec is for all inputs except C and C Clock. For C and C Clock, VIL(Max.) = VREF – 0.2V.

19.VREF (Min.) = 0.68V or 0.46VDDQ, whichever is larger, VREF (Max.) = 0.95V or 0.54VDDQ, whichever is smaller.

20.Tested initially and after any design or process change that may affect these parameters.

Document #: 38-05627 Rev. *A Page 15 of 19

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