CY7C1306BV25
CY7C1303BV25
Document #: 38-05627 Rev. *A Page 15 of 19
Maximum Ratings
(Above which the useful life may be impaired.)
Storage Temperature ................................–65°C to + 150°C
Ambient Temperature with
Power Applied............................................–55°C to + 125°C
Supply Voltage on VDD Relative to GND.......–0.5V to + 3.6V
Supply Voltage on VDDQ Relative to GND..... –0.5V to + VDD
DC Applied to Outputs in
High-Z State........................................ –0.5V to VDDQ + 0.5V
DC Input Voltage[17]...............................–0.5V to VDD + 0.5V
Current into Outputs (LOW).........................................20 mA
Static Discharge Voltage.......................................... > 2001V
(per MIL-STD-883, Method 3015)
Latch-up Current.................................................... > 200 mA
Operating Range
Range Ambient
Temperature (TA)V
DD[13] VDDQ[13]
Com’l 0°C to + 70°C 2.5 ± 0.1V 1.4V to 1.9V
Ind’l –40°C to + 85°C
Electrical Characteristics Over the Operating Range[14]
DC Electrical Characteristics Over the Operating Range
Parameter Description Test Conditions Min. Typ. Max. Unit
VDD Power Supply Voltage 2.4 2.5 2.6 V
VDDQ I/O Supply Voltage 1.4 1.5 1.9 V
VOH Output HIGH Voltage Note 15 VDDQ/2 – 0.12 VDDQ/2 + 0.12 V
VOL Output LOW Voltage Note 16 VDDQ/2 – 0.12 VDDQ/2 + 0.12 V
VOH(LOW) Output HIGH Voltage IOH = –0.1 mA, Nominal Impedance VDDQ – 0.2 VDDQ V
VOL(LOW) Output LOW Voltage IOL = 0.1 mA, Nominal Impedance VSS 0.2 V
VIH Input HIGH Voltage[17] VREF + 0.1 VDDQ + 0.3 V
VIL Input LOW Voltage[17, 18] –0.3 VREF – 0.1 V
VREF Input Reference Voltage[19] Typical value = 0.75V 0.68 0.75 0.95 V
IXInput Leakage Current GND ≤ VI ≤ VDDQ –5 5 µA
IOZ Output Leakage Current GND ≤ VI ≤ VDDQ, Output Disabled –5 5 µA
IDD VDD Operating Supply VDD = Max., IOUT = 0 mA,
f = fMAX = 1/tCYC
500 mA
ISB1 Automatic
Power-Down
Current
Max. VDD, Both Ports Deselected,
VIN ≥ VIH or VIN ≤ VIL f = fMAX =1/tCYC,
Inputs Static
240 mA
AC Input Requirements Over the Operating Range
Parameter Description Test Conditions Min. Typ. Max. Unit
VIH Input HIGH Voltage VREF + 0.2 – – V
VIL Input LOW Voltage – – VREF – 0.2 V
Thermal Resistance[20]
Parameter Description Test Conditions 165 FBGA Package Unit
ΘJA Thermal Resistance
(Junction to Ambient) Test conditions follow standard test methods and
procedures for measuring thermal impedance,
per EIA/JESD51.
16.7 °C/W
ΘJC Thermal Resistance
(Junction to Case) 6.5 °C/W
Notes:
13.Power-up: Assumes a linear ramp from 0V to VDD(min.) within 200 ms. During this time VIH < VDD and VDDQ < VDD.
14.All Voltage referenced to Ground.
15.Output are impedance controlled. IOH = –VDDQ/2)/(RQ/5) for values of 175Ω <= RQ <= 350Ω.
16.Output are impedance controlled. IOL = (VDDQ/2)/(RQ/5) for values of 175Ω <= RQ <= 350Ω.
17.Overshoot: VIH(AC) < VDDQ +0.85V (Pulse width less than tCYC/2), Undershoot: VIL(AC) > –1.5V (Pulse width less than tCYC/2).
18.This spec is for all inputs except C and C Clock. For C and C Clock, VIL(Max.) = VREF – 0.2V.
19.VREF (Min.) = 0.68V or 0.46VDDQ, whichever is larger, VREF (Max.) = 0.95V or 0.54VDDQ, whichever is smaller.
20.Tested initially and after any design or process change that may affect these parameters.
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