CY7C1306BV25
CY7C1303BV25

Document #: 38-05627 Rev. *A Page 18 of 19

© Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. C ypr ess S em icon duct or Corpo ra tion assu mes no resp onsib ility for th e u seof any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to beused for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize itsproducts for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypressproducts in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.

Quad Data Rate™ SRAM and QDR™ SRAM comprise a new family of p roducts developed by Cypress, IDT, NEC, Renesas and

Samsung. All products and company names mentioned in this document may be the trademarks of their respective holders.

Ordering Information

“Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or

visit www.cypress.com for actual products offered”.

Speed

(MHz) Ordering Code Package

Diagram Package Type Operating

Range

167 CY7C1303BV25-167BZC 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Commercial

CY7C1306BV25-167BZC

CY7C1303BV25-167BZXC 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead free

CY7C1306BV25-167BZXC

CY7C1303BV25-167BZI 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Industrial

CY7C1306BV25-167BZI

CY7C1303BV25-167BZXI 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead free

CY7C1306BV25-167BZXI

Package Diagram
A
1
PIN1 CORNER
15.00±0.10
13.00±0.10
7.00
1.00
Ø0.50 (165X)
Ø0.25MCAB
Ø0.05M C
B
A
0.15(4X)
0.35±0.06
SEATINGPLANE
0.53±0.05
0.25C
0.15C
PIN1CORNER
TOPVIEW
BOTTOMVIEW
2345678910
10.00
14.00
B
C
D
E
F
G
H
J
K
L
M
N
11
1110986754321
P
R
P
R
K
M
N
L
J
H
G
F
E
D
C
B
A
A
15.00±0.10
13.00±0.10
B
C
1.00
5.00
0.36
-0.06
+0.14
1.40MAX.
SOLDERPAD TYPE : NON-SOLDER MASK DEFINED (NSMD)
NOTES:
PACKAGEWEIGHT : 0.475g
JEDECREFERENCE : MO-216 / DESIGN 4.6C
PACKAGECODE : BB0AC
51-85180-*A

165 FBGA 13 x 15 x 1.40 MM BB165D/BW165D

A
1
PIN 1 CORNER
15.00±0.10
13.00±0.10
7.00
1.00
Ø0.50 (165X)
Ø0.25 M C A B
Ø0.05 M C
B
A
0.15(4X)
0.35±0.06
SEATING PLANE
0.53±0.05
0.25 C
0.15 C
PIN 1 CORNER
TOP VIEW
BOTTOM VIEW
2345678910
10.00
14.00
B
C
D
E
F
G
H
J
K
L
M
N
11
1110986754321
P
R
P
R
K
M
N
L
J
H
G
F
E
D
C
B
A
A
15.00±0.10
13.00±0.10
B
C
1.00
5.00
0.36
-0.06
+0.14
1.40 MAX.
SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD)
NOTES :
PACKAGE WEIGHT : 0.475g
JEDEC REFERENCE : MO-216 / DESIGN 4.6C
PACKAGE CODE : BB0AC
51-85180-*A

165-ball FBGA (13 x 15 x 1.4 mm) (51-85180)

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