CY7C1316BV18, CY7C1916BV18
CY7C1318BV18, CY7C1320BV18
Document Number: 38-05621 Rev. *D Page 22 of 31
Capacitance
Tested initially and after any design or process change that may affect these parameters.
Parameter Description Test Conditions Max Unit
CIN Input Capacitance TA = 25°C, f = 1 MHz, VDD = 1.8V, VDDQ = 1.5V 5 pF
CCLK Clock Input Capacitance 6 pF
COOutput Capacitance 7pF
Thermal Resistance
Tested initially and after any design or process change that may affect these parameters.
Parameter Description Test Conditions 165 FBGA
Package Unit
ΘJA Thermal Resistance
(Junction to Ambient) Test conditions follow standard test methods and
procedures for measuring thermal impedance, in
accordance with EIA/JESD51.
18.7 °C/W
ΘJC Thermal Resistance
(Junction to Case) 4.5 °C/W
Figure 4. AC Test Loads and Waveforms
1.25V
0.25V
R = 50Ω
5pF
INCLUDING
JIG AND
SCOPE
ALL INPUT PULSES
Device RL= 50Ω
Z0= 50Ω
VREF = 0.75V
VREF = 0.75V
[20]
0.75V
Under
Test
0.75V
Device
Under
Test
OUTPUT
0.75V
VREF
VREF
OUTPUT
ZQ
ZQ
(a)
Slew Rate = 2 V/ns
RQ =
250
Ω
(b)
RQ =
250
Ω
Note
20.Unless otherwise noted, test conditions assume signal transition time of 2V/ns, timing reference levels of 0.75V, VREF = 0.75V, RQ = 250Ω, VDDQ = 1.5V, input pulse
levels of 0.25V to 1.25V, and output loading of the specified IOL/IOH and load capacitance shown in (a) of AC Test Loads and Waveforms.
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