Cypress CY7C1336H manual Pin Definitions, Preliminary

PRELIMINARY

CY7C1336H

Pin Definitions

Name

I/O

Description

A0, A1,

Input-

Address Inputs used to select one of the 64K address locations. Sampled at the rising edge of the

A

Synchronous

CLK if ADSP or ADSC is active LOW, and

CE

1, CE2, and CE3 are sampled active. A[1:0] feed the 2-bit

counter.

A,

Input-

Byte Write Select Inputs, active LOW. Qualified with

to conduct Byte Writes to the SRAM.

BW

BWE

BWB

Synchronous

Sampled on the rising edge of CLK.

BWC,

BWD

Input-

Global Write Enable Input, active LOW. When asserted LOW on the rising edge of CLK, a global

GW

Synchronous

Write is conducted (ALL bytes are written, regardless of the values on BW[A:D] and BWE).

Input-

Byte Write Enable Input, active LOW. Sampled on the rising edge of CLK. This signal must be

BWE

Synchronous

asserted LOW to conduct a Byte Write.

CLK

Input-Clock

Clock Input. Used to capture all synchronous inputs to the device. Also used to increment the burst

counter when ADV is asserted LOW, during a burst operation.

1

Input-

Chip

Enable 1 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction with CE2

CE

Synchronous

and CE3 to select/deselect the device. ADSP is ignored if CE1 is HIGH. CE1 is sampled only when a

new external address is loaded.

CE2

Input-

Chip

Enable 2 Input, active HIGH. Sampled on the rising edge of CLK. Used in conjunction with

1

CE

Synchronous

and CE3 to select/deselect the device. CE2 is sampled only when a new external address is loaded.

3

Input-

Chip Enable 3 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction with

1

CE

CE

Synchronous

and CE2 to select/deselect the device. CE3 is sampled only when a new external address is loaded.

Input-

Output Enable, asynchronous input, active LOW. Controls the direction of the I/O pins. When LOW,

OE

Asynchronous

the I/O pins behave as outputs. When deasserted HIGH, I/O pins are tri-stated, and act as input data

pins. OE is masked during the first clock of a Read cycle when emerging from a deselected state.

Input-

Advance Input signal, sampled on the rising edge of CLK. When asserted, it automatically incre-

ADV

Synchronous

ments the address in a burst cycle.

Input-

Address Strobe from Processor, sampled on the rising edge of CLK, active LOW. When asserted

ADSP

Synchronous

LOW, addresses presented to the device are captured in the address registers. A[1:0]

are also loaded

into the burst counter. When ADSP and ADSC are both asserted, only ADSP is recognized. ASDP is

ignored when CE1 is deasserted HIGH

Input-

Address Strobe from Controller, sampled on the rising edge of CLK, active LOW. When asserted

ADSC

Synchronous

LOW, addresses presented to the device are captured in the address registers. A[1:0]

are also loaded

into the burst counter. When ADSP and ADSC are both asserted, only ADSP is recognized.

ZZ

Input-

ZZ “sleep” Input, active HIGH. When asserted HIGH places the device in a non-time-critical “sleep”

Asynchronous

condition with data integrity preserved. For normal operation, this pin has to be LOW or left floating.

ZZ pin has an internal pull-down.

DQs

I/O-

Bidirectional Data I/O lines. As inputs, they feed into an on-chip data register that is triggered by the

Synchronous

rising edge of CLK. As outputs, they deliver the data contained in the memory location specified by the

addresses presented during the previous clock rise of the Read cycle. The direction of the pins is

controlled by OE. When OE is asserted LOW, the pins behave as outputs. When HIGH, DQs are placed

in a tri-state condition.

VDD

Power

Power supply inputs to the core of the device.

Supply

VSS

Ground

Ground for the core of the device.

VDDQ

I/O Power

Power supply for the I/O circuitry.

Supply

VSSQ

I/O Ground

Ground for the I/O circuitry.

MODE

Input-

Selects Burst Order. When tied to GND selects linear burst sequence. When tied to VDD or left floating

Static

selects interleaved burst sequence. This is a strap pin and should remain static during device operation.

Mode Pin has an internal pull-up.

NC

No Connects. Not Internally connected to the die. 4M, 9M, 18M, 72M, 144M, 288M, 576M, and 1G are

address expansion pins and are not internally connected to the die.

Document #: 001-00210 Rev. *A

Page 3 of 15

[+] Feedback