CY7C1371D
CY7C1373D
Document #: 38-05556 Rev. *F Page 20 of 29
Capacitance[18]
Parameter Description Test Conditions
100 TQFP
Package
119 BGA
Package
165 FBGA
Package Unit
CIN Input Capacitance TA = 25°C, f = 1 MHz,
VDD = 3.3V
VDDQ = 2.5V
589pF
CCLK Clock Input Capacitance 5 8 9 pF
CIO Input/Output Capacitance 5 8 9 pF
Thermal Resistance[18]
Parameter Description Test Conditions
100 TQFP
Package
119 BGA
Package
165 FBGA
Package Unit
ΘJA Thermal Resistance
(Junction to Ambient)
Test conditions follow standard
test methods and procedures
for measuring thermal
impedance, according to
EIA/JESD51.
28.66 23.8 20.7 °C/W
ΘJC Thermal Resistance
(Junction to Case)
4.08 6.2 4.0 °C/W
AC Test Loads and Waveforms
OUTPUT
R = 317Ω
R = 351Ω
5pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
RL= 50Ω
Z0= 50Ω
V
T
= 1.5V
3.3V ALL INPUT PULSES
VDDQ
GND
90%
10%
90%
10%
≤1ns ≤1ns
(c)
OUTPUT
R = 1667Ω
R = 1538Ω
5pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
RL= 50Ω
Z0= 50Ω
VT= 1.25V
2.5V ALL INPUT PULSES
VDDQ
GND
90%
10%
90%
10%
≤1ns ≤1ns
(c)
3.3V IO Test Load
2.5V IO Test Load
Note:
18.Tested initially and after any design or process change that may affect these parameters.
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