Cypress CY7C1373D, CY7C1371D Capacitance18, Thermal Resistance18, AC Test Loads and Waveforms

CY7C1371D

CY7C1373D

Capacitance[18]

Parameter	Description	Test Conditions	100 TQFP	119 BGA	165 FBGA	Unit
			Package	Package	Package
CIN	Input Capacitance	TA = 25°C, f = 1 MHz,	5	8	9	pF
		VDD = 3.3V
CCLK	Clock Input Capacitance		5	8	9	pF
		VDDQ = 2.5V
CIO	Input/Output Capacitance		5	8	9	pF
Thermal Resistance[18]

Parameter	Description	Test Conditions	100 TQFP	119 BGA	165 FBGA	Unit
			Package	Package	Package
ΘJA	Thermal Resistance	Test conditions follow standard	28.66	23.8	20.7	°C/W
	(Junction to Ambient)	test methods and procedures
		for measuring thermal
ΘJC	Thermal Resistance		4.08	6.2	4.0	°C/W
		impedance, according to
	(Junction to Case)	EIA/JESD51.

AC Test Loads and Waveforms

3.3V IO Test Load

OUTPUT

3.3V

R = 317Ω

ALL INPUT PULSES

VDDQ

Z0

= 50Ω

OUTPUT

RL

= 50Ω

10%

90%

5 pF

R = 351Ω

GND

≤ 1ns

VT = 1.5V

INCLUDING

(c)

(a)

JIG AND

(b)

SCOPE

2.5V IO Test Load

OUTPUT

2.5V

R = 1667Ω

ALL INPUT PULSES

VDDQ

Z0

= 50Ω

OUTPUT

RL

= 50Ω

10%

90%

5 pF

R = 1538Ω

GND

≤ 1ns

VT = 1.25V

INCLUDING

(c)

(a)

JIG AND

(b)

SCOPE

90%

10%

≤ 1ns

90%

10%

≤ 1ns

Note:

18. Tested initially and after any design or process change that may affect these parameters.

Document #: 38-05556 Rev. *F Page 20 of 29

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