CY7C1371D
CY7C1373D
Document #: 38-05556 Rev. *F Page 28 of 29
© Cypress Semiconductor Corporation, 2004-2007. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the
use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to
be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
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NoBL and No Bus Latency are trademarks of Cypress Semiconductor Corporation. ZBT is a trademark of Integrated Device
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Figure 3. 165-Ball FBGA (13 x 15 x 1.4 mm) (51-85180)
Package Diagrams (continued)
A
1
PIN1CORNER
15.00±0.10
13.00±0.10
7.00
1.00
Ø0.50 (165X)
Ø0.25MCAB
Ø0.05MC
B
A
0.15(4X)
0.35±0.06
SEATINGPLANE
0.53±0.05
0.25C
0.15C
PIN1CORNER
TOPVIEW
BOTTOMVIEW
2345678910
10.00
14.00
B
C
D
E
F
G
H
J
K
L
M
N
11
1110986754321
P
R
P
R
K
M
N
L
J
H
G
F
E
D
C
B
A
A
15.00±0.10
13.00±0.10
B
C
1.00
5.00
0.36
-0.06
+0.14
1.40MAX.
SOLDERPAD TYPE : NON-SOLDER MASK DEFINED (NSMD)
NOTES:
PACKAGEWEIGHT : 0.475g
JEDECREFERENCE : MO-216 / DESIGN 4.6C
PACKAGECODE : BB0AC
51-85180-*A
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