Cypress CY7C1373D, CY7C1371D manual Ball Fbga 13 x 15 x 1.4 mm

CY7C1371D

CY7C1373D

Package Diagrams (continued)

Figure 3. 165-Ball FBGA (13 x 15 x 1.4 mm) (51-85180)

15.00±0.10

TOP VIEW

PIN 1 CORNER

1 2 3 4 5 6 7 8 9 10 11

A

B

C

D

E

F

G

H

J

K

L

M

N

P

R

15.00±0.10

14.00

BOTTOM VIEW

PIN 1 CORNER

Ø0.05 M C Ø0.25 M C A B

-0.06

Ø0.50 (165X)

+0.14

11 10 9 8 7 6 5 4 3 2 1

1.00

7.00

A

B

C

D

E

F

G

H

J

K

L

M

N

P

R

A

B

0.25 C	0.53±0.05
	0.36

13.00±0.10

SEATING PLANE

C

1.40MAX. 0.15C

0.35±0.06

A

1.00

5.00

10.00

B 13.00±0.10

0.15(4X)

NOTES :

SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD)

PACKAGE WEIGHT : 0.475g

JEDEC REFERENCE : MO-216 / DESIGN 4.6C PACKAGE CODE : BB0AC

51-85180-*A

NoBL and No Bus Latency are trademarks of Cypress Semiconductor Corporation. ZBT is a trademark of Integrated Device Technology, Inc. All product and company names mentioned in this document are the trademarks of their respective holders.

Document #: 38-05556 Rev. *F Page 28 of 29

© Cypress Semiconductor Corporation, 2004-2007. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.

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