CY7C1381D, CY7C1381F
CY7C1383D, CY7C1383F
Document #: 38-05544 Rev. *F Page 15 of 29
Identification Register Definitions
Instruction Field
CY7C1381D/CY7C1381F
(512K × 36)
CY7C1383D/CY7C1383F
(1M × 18) Description
Revision Number (31:29) 000 000 Describes the version number.
Device Depth (28:24) [13] 01011 01011 Reserved for internal use.
Device Width (23:18) 119-BGA 101001 101001 Defines the memory type and
architecture.
Device Width (23:18) 165-FBGA 000001 000001 Defines the memory type and
architecture.
Cypress Device ID (17:12) 100101 010101 Defines the width and density.
Cypress JEDEC ID Code (11:1) 00000110100 00000110100 Allows unique identification of SRAM
vendor.
ID Register Presence Indicator (0) 1 1 Indicates the presence of an ID
register.
Scan Register Sizes
Register Name Bit Size (×36) Bit Size (×18)
Instruction Bypass 3 3
Bypass 1 1
ID 32 32
Boundary Scan Order (119-ball BGA package) 85 85
Boundary Scan Order (165-ball fBGA package) 89 89
Identification Codes
Instruction Code Description
EXTEST 000 Captures Input/Output ring contents. Places the boundary scan register between TDI and
TDO. Forces all SRAM outputs to High-Z state.
IDCODE 001 Loads the ID register with the vendor ID code and places the register between TDI and TDO.
This operation does not affect SRAM operations.
SAMPLE Z 010 Captures Input/Output ring contents. Places the boundary scan register between TDI and
TDO. Forces all SRAM output drivers to a High-Z state.
RESERVED 011 Do Not Use. This instruction is reserved for future use.
SAMPLE/PRELOAD 100 Captures Input/Output ring contents. Places the boundary scan register between TDI and
TDO. Does not affect SRAM operation.
RESERVED 101 Do Not Use. This instruction is reserved for future use.
RESERVED 110 Do Not Use. This instruction is reserved for future use.
BYPASS 111 Places the bypass register between TDI and TDO. This operation does not affect SRAM
operations.
Note:
13.Bit #24 is “1” in the register definitions for both 2.5V and 3.3V versions of this device.
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