Contents
Main
18-Mbit (512K x 36/1M x 18) Flow-Through SRAM
CY7C1381D, CY7C1381F CY7C1383D, CY7C1383F
Features
Functional Description
Selection Guide
Logic Block Diagram CY7C1381D/CY7C1381F [3] (512K x 36)
Logic Block Diagram CY7C1383D/CY7C1383F[3] (1M x 18)
DQs DQP DQP
Note: 3. CY7C1381F and CY7C1383F have only 1 chip enable (CE1).
CY7C1381D, CY7C1381F CY7C1383D, CY7C1383F
Document #: 38-05544 Rev. *F Page 3 of 29
Pin Configurations
CY7C1381D (512K x 36)
CY7C1383D (1M x 18)
Pin Configurations
CY7C1381F (512K x 36)
CY7C1383F (1M x 18)
119-Ball BGA Pinout
Pin Configurations 165-Ball FBGA Pinout (3 Chip Enable)
CY7C1381D (512K x 36)
CY7C1383D (1M x 18)
2345671 A B C D E F G H J K L M N P R
891011
Pin Definitions
CY7C1381D, CY7C1381F CY7C1383D, CY7C1383F
Functional Overview
Pin Definitions
CY7C1381D, CY7C1381F CY7C1383D, CY7C1383F
Interleaved Burst Address Table (MODE = Floating or VDD)
Linear Burst Address Table (MODE = GND)
ZZ Mode Electrical Characteristics
Truth Table
Truth Table for Read/Write
IEEE 1149.1 Serial Boundary Scan (JTAG)
TAP Controller State Diagram
TAP Controller Block Diagram
Page
CY7C1381D, CY7C1381F CY7C1383D, CY7C1383F
TAP Ti min g
TAP AC Switching Characteristics
3.3V TAP AC Test Conditions
3.3V TAP AC Output Load Equivalent
2.5V TAP AC Test Conditions
2.5V TAP AC Output Load Equivalent
TAP DC Electrical Characteristics And Operating Conditions
Identification Register Definitions
Scan Register Sizes
Identification Codes
119-Ball BGA Boundary Scan Order[14, 15]
165-Ball BGA Boundary Scan Order[14, 16]
Maximum Ratings
Operating Range
Electrical Characteristics
Capacitance
Thermal Resistance
Switching Characteristics
Timing Diagrams
Read Cycle Timing
Write Cycle Timing
Read/Write Cycle Timing
ZZ Mode Timing
Ordering Information
Package Diagrams
Figure 1. 100-Pin Thin Plastic Quad Flat pack (14 x 20 x 1.4 mm) (51-85050)
A
Page
Figure 3. 165-ball FBGA (13 x 15 x 1.4 mm) (51-85180)
SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD)
1.40 MAX.
51-85180-*A
Package Diagrams
NOTES: PACKAGEWEIGHT : 0.475g JEDECREFERENCE : MO-216 / DESIGN 4.6C PACKAGECODE : BB0AC
165 FBGA 13 x 15 x 1.40 MM BB165D/BW165D
-
NOTES : PACKAGE WEIGHT : 0.475g JEDEC REFERENCE : MO-216 / DESIGN 4.6C PACKAGE CODE : BB0AC
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