CY7C1381D, CY7C1381F
CY7C1383D, CY7C1383F
Document #: 38-05544 Rev. *F Page 28 of 29
© Cypress Semiconductor Corporation, 2006-2007. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility forthe use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intendedto be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorizeits products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypressproducts in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.

Intel and Pentium are registered trademarks, and i486 is a trademark of Intel Corporation. All product and company names

mentioned in this document are the trademarks of their respective holders.

Figure 3. 165-ball FBGA (13 x 15 x 1.4 mm) (51-85180)

Package Diagrams (continued)
A
1
PIN1CORNER
15.00±0.10
13.00±0.10
7.00
1.00
Ø0.50 (165X)
Ø0.25MCAB
Ø0.05MC
B
A
0.15(4X)
0.35±0.06
SEATINGPLANE
0.53±0.05
0.25C
0.15C
PIN1CORNER
TOPVIEW
BOTTOMVIEW
2345678910
10.00
14.00
B
C
D
E
F
G
H
J
K
L
M
N
11
1110986754321
P
R
P
R
K
M
N
L
J
H
G
F
E
D
C
B
A
A
15.00±0.10
13.00±0.10
B
C
1.00
5.00
0.36
-0.06
+0.14
1.40MAX.
SOLDERPAD TYPE : NON-SOLDER MASK DEFINED (NSMD)
NOTES:
PACKAGEWEIGHT : 0.475g
JEDECREFERENCE : MO-216 / DESIGN 4.6C
PACKAGECODE : BB0AC
51-85180-*A

165 FBGA 13 x 15 x 1.40 MM BB165D/BW165D

A
1
PIN 1 CORNER
15.00±0.10
13.00±0.10
7.00
1.00
Ø0.50 (165X)
Ø0.25 M C A B
Ø0.05 M C
B
A
0.15(4X)
0.35±0.06
SEATING PLANE
0.53±0.05
0.25 C
0.15 C
PIN 1 CORNER
TOP VIEW
BOTTOM VIEW
2345678910
10.00
14.00
B
C
D
E
F
G
H
J
K
L
M
N
11
1110986754321
P
R
P
R
K
M
N
L
J
H
G
F
E
D
C
B
A
A
15.00±0.10
13.00±0.10
B
C
1.00
5.00
0.36
-0.06
+0.14
1.40 MAX.

SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD)

NOTES :

PACKAGE WEIGHT : 0.475g

JEDEC REFERENCE : MO-216 / DESIGN 4.6C

PACKAGE CODE : BB0AC

51-85180-*A
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