Cypress CY7C1412JV18, CY7C1410JV18, CY7C1425JV18 manual Package Diagram, Ball Fbga 15 x 17 x 1.40 mm

CY7C1410JV18, CY7C1425JV18

CY7C1412JV18, CY7C1414JV18

Package Diagram

Figure 4. 165-ball FBGA (15 x 17 x 1.40 mm), 51-85195

TOP VIEW

PIN 1 CORNER

1 2 3 4 5 6 7 8 9 10 11

A

B

C

D

E

F

G

H

J

K

L

M

N

P

R

	BOTTOM VIEW										PIN 1 CORNER
						Ø0.05 M C
						Ø0.25 M C A B
						Ø0.50		+0.14
								(165X)
								-0.06
	11	10	9	8	7	6	5	4	3	2	1
											A
											B
	1.00										C
											D
											E
											F
17.00±0.10	14.00										G
											H
											J
											K
	7.00										L
											M
											N
											P
											R
A								1.00
			5.00
					10.00
	B			15.00±0.10

0.15(4X)

0.25 C

0.53±0.05

C 0.36

0.35±0.06	0.15 C
SEATING PLANE
	1.40 MAX.

NOTES :

SOLDER PAD TYPE : NON SOLDER MASK DEFINED (NSMD)

PACKAGE WEIGHT : 0.65g

JEDEC REFERENCE : MO-216 / DESIGN 4.6C

PACKAGE CODE : BB0AD

51-85195-*A

Document #: 001-12561 Rev. *D Page 25 of 26

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