Cypress CY7C1462AV33 manual Document History, ECN No Issue Date Orig. Description of Change

CY7C1460AV33

CY7C1462AV33

CY7C1464AV33

Document History Page

Document Title: CY7C1460AV33/CY7C1462AV33/CY7C1464AV33 36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL™ Architecture

Document Number: 38-05353

REV.	ECN No.	Issue Date	Orig. of	Description of Change
			Change
**	254911	See ECN	SYT	New Data sheet
				Part number changed from previous revision. New and old part number differ
				by the letter “A”
*A	303533	See ECN	SYT	Changed H9 pin from VSSQ to VSS on the Pin Configuration table for 209
				FBGA on Page # 5
				Changed the test condition from VDD = Min to VDD = Max for VOL in the
				Electrical Characteristics table
				Replaced ΘJA and ΘJC from TBD to respective Thermal Values for All
				Packages on the Thermal Resistance Table
				Changed IDD from 450, 400 & 350 mA to 475, 425 & 375 mA for 250, 200
				and 167 MHz respectively
				Changed ISB1 from 190, 180 and 170 mA to 225 mA for 250, 200 and 167
				MHz respectively
				Changed ISB2 from 80 mA to 100 mA for all frequencies
				Changed ISB3 from 180, 170 & 160 mA to 200 mA for 250, 200 and 167 MHz
				respectively
				Changed ISB4 from 100 mA to 110 mA for all frequencies
				Changed CIN, CCLK and CI/O to 6.5, 3 and 5.5 pF from 5, 5 and 7 pF for TQFP
				Package
				Changed tCO from 3.0 to 3.2 ns and tDOH from 1.3 ns to 1.5 ns for 200 MHz
				Speed Bin
				Added lead-free information for 100-pin TQFP and 165 FBGA and 209 BGA
				packages
*B	331778	See ECN	SYT	Modified Address Expansion balls in the pinouts for 165 FBGA and 209 BGA
				Package as per JEDEC standards and updated the Pin Definitions accord-
				ingly
				Modified VOL, VOH test conditions
				Changed CIN, CCLK and CI/O to 7, 7and 6 pF from 5, 5 and 7 pF for 165 FBGA
				Package
				Added Industrial Temperature Grade
				Changed ISB2 and ISB4 from 100 and 110 mA to 120 and 135 mA respectively
				Updated the Ordering Information by Shading and Unshading MPNs as per
				availability
*C	417509	See ECN	RXU	Converted from Preliminary to Final
				Changed address of Cypress Semiconductor Corporation on Page# 1 from
				“3901 North First Street” to “198 Champion Court”
				Changed IX current value in MODE from –5 & 30 ∝A to –30 & 5 ∝A respec-
				tively and also Changed IX current value in ZZ from –30 & 5 ∝A to –5 & 30
				∝A respectively on page# 18
				Modified test condition from VIH < VDD to VIH < VDD
				Modified “Input Load” to “Input Leakage Current except ZZ and MODE” in the
				Electrical Characteristics Table
				Replaced Package Name column with Package Diagram in the Ordering
				Information table
				Replaced Package Diagram of 51-85050 from *A to *B
*D	473229	See ECN	NXR	Added the Maximum Rating for Supply Voltage on VDDQ Relative to GND
				Changed tTH, tTL from 25 ns to 20 ns and tTDOV from 5 ns to 10 ns in TAP
				AC Switching Characteristics table
				Updated the Ordering Information table.

Document #: 38-05353 Rev. *D Page 27 of 27

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