![](/images/new-backgrounds/1110432/11043211x1.webp)
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| CY7C1460AV33 | |||
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| CY7C1462AV33 | |||
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| CY7C1464AV33 | |||
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| Pin Definitions (continued) |
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| Pin Name | I/O Type |
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| Pin Description | ||||||||||
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| CLK | Input- | Clock Input. Used to capture all synchronous inputs to the device. CLK is qualified with | ||||||||||||||||
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| Clock | CEN. CLK is only recognized if CEN is active LOW. | |||||||||||||
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| 1 |
| Input- | Chip Enable 1 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction | ||||||||||||||
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| CE | ||||||||||||||||||
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| Synchronous | with CE2 and CE3 to select/deselect the device. | |||||||||||||
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| CE2 | Input- | Chip Enable 2 Input, active HIGH. Sampled on the rising edge of CLK. Used in | ||||||||||||||||
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| Synchronous | conjunction with CE1 and CE3 to select/deselect the device. | |||||||||||||
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| 3 |
| Input- | Chip Enable 3 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction | ||||||||||||||
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| CE | ||||||||||||||||||
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| Synchronous | with CE1 and CE2 to select/deselect the device. | |||||||||||||
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| Input- | Output Enable, active LOW. Combined with the synchronous logic block inside the device | |||||||||||||
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| OE | ||||||||||||||||||
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| Asynchronous | to control the direction of the I/O pins. When LOW, the I/O pins are allowed to behave as | |||||||||||||
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| outputs. When deasserted HIGH, I/O pins are | |||||||||||
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| masked during the data portion of a write sequence, during the first clock when emerging | |||||||||||
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| from a deselected state and when the device has been deselected. | |||||||||||
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| Input- | Clock Enable Input, active LOW. When asserted LOW the clock signal is recognized by | |||||||||||||
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| CEN | ||||||||||||||||||
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| Synchronous | the SRAM. When deasserted HIGH the clock signal is masked. Since deasserting CEN | |||||||||||||
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| does not deselect the device, | CEN | can be used to extend the previous cycle when required. | |||||||||
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| DQa | I/O- | Bidirectional Data I/O lines. As inputs, they feed into an | ||||||||||||||||
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| DQb | Synchronous | triggered by the rising edge of CLK. As outputs, they deliver the data contained in the | ||||||||||||||||
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| DQc |
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| memory location specified by AX during the previous clock rise of the read | cycle. The | |||||||||||||
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| DQd |
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| direction of the pins is controlled by OE and the internal control logic. When OE is asserted | ||||||||||||||
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| DQe |
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| LOW, the pins can behave as outputs. When HIGH, | ||||||||||||||
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| DQf |
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| condition. The outputs are automatically | ||||||||||||||
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| DQg |
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| sequence, during the first clock when emerging | from a deselected state, and when the | |||||||||||||
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| DQh |
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| device is deselected, regardless of the state of OE. | ||||||||||||||
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| DQPa,DQPb, | I/O- | Bidirectional Data Parity I/O lines. Functionally, these signals are identical to DQ[31:0]. | ||||||||||||||||
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| DQPc,DQPd | Synchronous | During write sequences, DQPa is controlled by | BW | a, DQPb is controlled by BWb, DQPc is | ||||||||||||||
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| DQPe,DQPf |
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| controlled by BWc, and DQPd is controlled by BWd, DQPe is controlled by BWe, DQPf is | ||||||||||||||
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| DQPg,DQPh |
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| controlled by BWf, DQPg is controlled by BWg, DQPh is controlled by BWh. | ||||||||||||||
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| MODE | Input Strap Pin | Mode Input. Selects the burst order of the device. Tied HIGH selects the interleaved burst | ||||||||||||||||
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| order. Pulled LOW selects the linear burst order. MODE should not change states during | |||||||||||
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| operation. When left floating MODE will default HIGH, to an interleaved burst order. | |||||||||||
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| TDO | JTAG serial output | Serial | ||||||||||||||||
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| Synchronous |
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| TDI | JTAG serial input | Serial | ||||||||||||||||
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| Synchronous |
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| TMS | Test Mode Select | This pin controls the Test Access Port state machine. Sampled on the rising edge of | ||||||||||||||||
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| Synchronous | TCK. | |||||||||||||
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| TCK | Clock input to the JTAG circuitry. | |||||||||||||||||
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| VDD | Power Supply | Power supply inputs to the core of the device. | ||||||||||||||||
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| VDDQ | I/O Power Supply | Power supply for the I/O circuitry. | ||||||||||||||||
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| VSS | Ground | Ground for the device. Should be connected to ground of the system. | ||||||||||||||||
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| NC | N/A | No connects. This pin is not connected to the die. | ||||||||||||||||
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| NC/72M | N/A | Not connected to the die. Can be tied to any voltage level. | ||||||||||||||||
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| NC/144M | N/A | Not connected to the die. Can be tied to any voltage level. | ||||||||||||||||
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| NC/288M | N/A | Not connected to the die. Can be tied to any voltage level. | ||||||||||||||||
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| NC/576M | N/A | Not connected to the die. Can be tied to any voltage level. | ||||||||||||||||
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| NC/1G | N/A | Not connected to the die. Can be tied to any voltage level. | ||||||||||||||||
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| ZZ | Input- | ZZ “sleep” Input. This active HIGH input places the device in a | ||||||||||||||||
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| Asynchronous | condition with data integrity preserved. During normal operation, this pin can be connected | |||||||||||||
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| to VSS or left floating. ZZ pin has an internal | |||||||||||
Document #: |
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| Page 6 of 27 |
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