CY7C1460AV33
CY7C1462AV33
CY7C1464AV33
Document #: 38-05353 Rev. *D Page 18 of 27
Note:
17.Tested initially and after any design or process changes that may affect these parameters.
Capacitance[17]
Parameter Description Test Conditions 100 TQFP
Max. 165 FBGA
Max. 209 FBGA
Max. Unit
CIN Input Capacitance TA = 25°C, f = 1 MHz,
VDD = 2.5V VDDQ = 2.5V 6.5 7 5 pF
CCLK Clock Input Capacitance 3 7 5 pF
CI/O Input/Output Capacitance 5.5 6 7 pF
Thermal Resistance[17]
Parameters Description Test Conditions 100 TQFP
Package 165 FBGA
Package 209 FBGA
Package Unit
ΘJA Thermal Resistance
(Junction to Ambient) Test conditions follow standard
test methods and procedures
for measuring thermal
impedance, per EIA/JESD51.
25.21 20.8 25.31 °C/W
ΘJC Thermal Resistance
(Junction to Case) 2.28 3.2 4.48 °C/W
AC Test Loads and Waveforms
OUTPUT
R = 317Ω
R = 351Ω
5pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
RL= 50Ω
Z0= 50Ω
V
T
= 1.5V
3.3V ALL INPUT PULSES
VDDQ
GND
90%
10% 90%
10%
≤1 ns ≤1 ns
(c)
3.3V I/O Test Load
OUTPUT
R = 1667Ω
R =1538Ω
5pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
RL= 50Ω
Z0= 50Ω
VT= 1.25V
2.5V ALL INPUT PULSES
VDDQ
GND
90%
10% 90%
10%
≤1 ns ≤1 ns
(c)
2.5V I/O Test Load
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