Cypress CY7C1462AV33 manual Capacitance17, Thermal Resistance17, AC Test Loads and Waveforms

CY7C1460AV33

CY7C1462AV33

CY7C1464AV33

Capacitance[17]

Parameter	Description	Test Conditions	100 TQFP	165 FBGA	209 FBGA	Unit
			Max.	Max.	Max.
CIN	Input Capacitance	TA = 25°C, f = 1 MHz,	6.5	7	5	pF
		VDD = 2.5V VDDQ = 2.5V
CCLK	Clock Input Capacitance		3	7	5	pF
CI/O	Input/Output Capacitance		5.5	6	7	pF

Thermal Resistance[17]

Parameters	Description	Test Conditions	100 TQFP	165 FBGA	209 FBGA	Unit
			Package	Package	Package
ΘJA	Thermal Resistance	Test conditions follow standard	25.21	20.8	25.31	°C/W
	(Junction to Ambient)	test methods and procedures
		for measuring thermal
ΘJC	Thermal Resistance		2.28	3.2	4.48	°C/W
		impedance, per EIA/JESD51.
	(Junction to Case)

AC Test Loads and Waveforms

3.3V I/O Test Load					3.3V		R = 317Ω
OUTPUT
	Z0	= 50Ω			OUTPUT
				RL	= 50Ω
						5 pF		R = 351Ω
					INCLUDING
			VT = 1.5V
					JIG AND

VDDQ	ALL INPUT PULSES
			90%
10%		90%		10%
GND				≤ 1 ns
≤ 1 ns

			(a)		SCOPE			(b)
2.5V I/O Test Load					2.5V			R = 1667Ω
OUTPUT
	Z0	= 50Ω			OUTPUT
				RL = 50Ω
						5 pF			R =1538Ω
					INCLUDING
			VT = 1.25V
					JIG AND
			(a)				(b)
					SCOPE

Note:

17. Tested initially and after any design or process changes that may affect these parameters.

		(c)
VDDQ	ALL INPUT PULSES
		90%
10%
GND
≤ 1 ns

(c)

90%

10%

≤ 1 ns

Document #: 38-05353 Rev. *D Page 18 of 27

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