Package Diagrams, Lead 300-Mil Molded DIP P21 | Cypress CY7C185

CY7C185

Package Diagrams

28-Lead (300-Mil) Molded DIP P21

51-85014-B

28-Lead (300-Mil) Molded SOIC S21

51-85026-A

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Cypress CY7C185 specifications Package Diagrams, Lead 300-Mil Molded DIP P21, Lead 300-Mil Molded Soic S21

Contents

Logic Block Diagram Pin Configurations FeaturesFunctional Description Selection Guide1 Maximum Ratings Electrical Characteristics Over the Operating RangeOperating Range Ambient Range AC Test Loads and Waveforms Capacitance4= GND Parameter Description Test Conditions Max Unit CE2 Switching Characteristics Over the Operating Range5 Switching Waveforms Read Cycle No.19,10Write Cycle No WE Controlled10,12 Write Cycle No WE Controlled, OE LOW12,13,14,15 Write Cycle No CE Controlled12,13,14 Normalized Supply Current Typical DC and AC Characteristics Truth Table Address DesignatorsOrdering Information Package Diagrams Lead 300-Mil Molded DIP P21Lead 300-Mil Molded Soic S21 Lead 300-Mil Molded SOJ