Cypress CY8C24223A, CY8C24423A manual Thermal Impedances, Capacitance on Crystal Pins

CY8C24223A, CY8C24423A

Figure 18. 28-Pin (210-Mil) SSOP

51-85079 *C

Thermal Impedances

Table 29. Thermal Impedances per Package

Package	Typical θJA *
20 SSOP	117 oC/W
28 SSOP	101 oC/W
* TJ = TA + POWER x θJA

Capacitance on Crystal Pins

Table 30. Typical Package Capacitance on Crystal Pins

Package	Package Capacitance
20 SSOP	2.6 pF
28 SSOP	2.8 pF

Solder Reflow Peak Temperature

The following table lists the minimum solder reflow peak temperature to achieve good solderability.

Table 31. Solder Reflow Peak Temperature

Package	Minimum Peak Temperature*	Maximum Peak Temperature
20 SSOP	240oC	260oC
28 SSOP	240oC	260oC

*Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5oC with Sn-Pb or 245 ± 5oC with Sn-Ag-Cu paste. Refer to the solder manufacturer specifications.

Document Number: 3-12029 Rev. *E Page 29 of 31

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