CY8C24223A, CY8C24423A
Packaging Information
This section illustrates the packaging specifications for the CY8C24x23A automotive PSoC device, along with the thermal impedances for each package and the typical package capacitance on crystal pins.
Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of the emulation tools’ dimensions, refer to the document titled PSoC Emulator Pod Dimensions at http://www.cypress.com/design/MR10161.
Figure 17. 20-Pin (210-Mil) SSOP
Document Number: | Page 28 of 31 |
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