CY8C24223A, CY8C24423A

Packaging Information

This section illustrates the packaging specifications for the CY8C24x23A automotive PSoC device, along with the thermal impedances for each package and the typical package capacitance on crystal pins.

Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of the emulation tools’ dimensions, refer to the document titled PSoC Emulator Pod Dimensions at http://www.cypress.com/design/MR10161.

Figure 17. 20-Pin (210-Mil) SSOP

51-85077 *C

Document Number: 3-12029 Rev. *E

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Cypress CY8C24423A, CY8C24223A manual Packaging Information, Pin 210-Mil Ssop