Thermal Resistance, AC Test Conditions | Cypress STK11C68-5 instruction

STK11C68-5 (SMD5962-92324)

Thermal Resistance

In this table, the thermal resistance parameters are listed.[3]

Parameter	Description	Test Conditions	28-CDIP	28-LCC	Unit
ΘJA	Thermal Resistance	Test conditions follow standard test methods and proce-	TBD	TBD	°C/W
	(Junction to Ambient)	dures for measuring thermal impedance, per EIA /
		JESD51.
ΘJC	Thermal Resistance	JESD51.	TBD	TBD	°C/W
	(Junction to Case)
		Figure 5. AC Test Loads

R1 480Ω

5.0V

Output

255Ω

Input Pulse Levels	0V to 3V
Input Rise and Fall Times (10% to 90%)	<5 ns
Input and Output Timing Reference Levels	1.5V

Document Number: 001-51001 Rev. *A

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Contents

Functional Description FeaturesLogic Block Diagram Cypress Semiconductor Corporation 198 Champion Court Pinouts Output Enable, Active LOW. The active LOWPower Supply Inputs to the Device Pin Definitions Sram Read Hardware Recall Power UpDevice Operation Sram Write Low Average Active Power Hardware Mode Selection A12-A0Best Practices Operating Range DC Electrical CharacteristicsMaximum Ratings Data Retention and Endurance Thermal Resistance AC Test ConditionsParameter Description Test Conditions Cdip 28-LCC Unit Sram Read Cycle AC Switching CharacteristicsSwitching Waveforms Min Max Parameter Sram Write Cycle AutoStore Inhibit or Power Up Recall Parameter Alt Description STK11C68-5 Unit Min Max Parameter Alt Description 35 ns 45 ns 55 ns Unit Min Switching WaveformSoftware Controlled STORE/RECALL Cycle Min Max Part Numbering Nomenclature STK11C68 5 C 45 M SMD5962-92324 04 MX Ordering Information Package Diagrams Pin 300-Mil Side Braze DIL Pad 350-Mil LCC Sales, Solutions, and Legal Information Worldwide Sales and Design Support Products PSoC SolutionsDocument History