Removal and replacement procedures
✎The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly and the system board each time the fan/heat sink assembly is removed:
■Thermal paste is used on the processor 1 and the heat sink section 2 that services it.
■Thermal pads are used on the Northbridge chip 3 and the heat sink section 4 that services it.
■Thermal pads are used on the graphics subsystem memory module 5 and the heat sink section 6 that services it.
■Thermal pads are used on the other system board components 7 and heat sink sections 8 that service them.
Replacement thermal material is included with all system board, fan/heat sink assembly, and processor spare part kits.
