HP CQ40-417TU, CQ40-416TU, CQ40-408AU, CQ40-404AX, CQ40-421AX, CQ40-409TU manual Heat sink

Heat sink

Description	Spare part number
Heat sink (includes thermal material)	530614-001

NOTE: To properly ventilate the computer, allow at least a 7.6-cm (3-in) clearance on the right side and rear panel of the computer. The computer uses an electric fan for ventilation. The fan is controlled by a temperature sensor and is designed to turn on automatically when high temperature conditions exist. These conditions are affected by high external temperatures, system power consumption, power management/battery conservation configurations, battery fast charging, and software requirements. Exhaust air is displaced through the ventilation grill located on the left side of the computer.

NOTE: Thermal pads and thermal paste are included with all heat sink, system board, and processor spare part kits.

Before removing the heat sink, follow these steps:

1.Shut down the computer. If you are unsure whether the computer is off or in Hibernation, turn the computer on, and then shut it down through the operating system.

2.Disconnect all external devices connected to the computer.

3.Disconnect the power from the computer by first unplugging the power cord from the AC outlet and then unplugging the AC adapter from the computer.

4.Remove the battery (see Battery on page 34).

5.Remove the following components:

a.Hard drive (see Hard drive on page 36)

b.Optical drive (see Optical drive on page 35)

c.Keyboard (see Keyboard on page 44)

d.Keyboard cover (see Keyboard cover on page 46)

e.Speaker assembly (see Speaker assembly on page 49)

f.Display assembly (see Display assembly on page 51)

g.Top cover (see Top cover on page 59)

h.System board (see System board on page 74)

Remove the heat sink:

1.Turn the system board upside down with the external monitor port toward you.

2.Loosen the four Phillips PM2.0×10.0 captive screws (1) that secure the heat sink to the system board.

NOTE: Due to the adhesive quality of the thermal material located between the heat sink and system board components, it may be necessary to move the heat sink from side to side to detach the assembly.

Component replacement procedures 77