5.When a connection is established, press Enter and then log in. The Main menu for the management module appears. Follow the onscreen options to configure the management module.

Configuring Minicom

NOTE: The following example uses Red Hat Linux 3.0. For more information, refer to your Linux operating system Help or documentation.

IMPORTANT: Minicom is a utility that is loaded during the installation of Linux. However, if you do not select the option to install the Linux Utilities during the operating system installation, you cannot use Minicom without downloading the Minicom X.X.i386.rpm file from the Red Hat website. (Refer to the procedure for installing RPMs on the Red Hat website.)

1.Log in to a Linux console, or open a terminal and enter minicom-sat the command prompt. The Configuration menu appears.

2.Select Serial Port Setup. The Change which setting? menu appears.

3.Select Option A (Serial Device). Manually change the device type from "dev/modem" to "/dev/ttyS0" and press Enter.

4.Select Option E (Bps/Par/Bits). The Comm Parameters menu appears.

5.Select E (Speed 9600 Bps), and press Enter. The designation 9600 8 N1 appears next to Option E.

6.Select Option F (Hardware Flow Control).

7.Be sure that the Change which setting? menu is configured as follows: o A—Serial Device: /dev/ttyS0

o B—Lockfile Location: /var/lock o C—Callin Program:

o D—Callout Program:

o E—Bps/Par/Bits: 9600 8 N1

o F—Hardware Flow Control: No

o G—Software Flow Control: No

8.Press Enter to return to the Configuration menu. Scroll down to the Save setup as default option, and press Enter. Scroll down the Configuration menu to the Exit from the Minicom option, and press Enter.

9.From the command prompt, enter Minicom. As soon as a connection is established, press Enter and log in. The Main menu for the management module appears. Follow the onscreen options to configure the management module.

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HP Modular Cooling System manual Configuring Minicom

Modular Cooling System specifications

The HP Modular Cooling System (MCS) is a state-of-the-art solution designed to efficiently manage the heat generated by high-density IT environments. As data centers face the ever-increasing demand for processing power, traditional cooling methods often fall short, leading to inefficiencies and raised energy costs. The HP MCS addresses this issue with a scalable, flexible design that optimizes cooling performance while minimizing energy consumption.

One of the main features of the HP Modular Cooling System is its modular architecture, which allows for easy expansion and customization based on the specific needs of a data center. This scalability means that as a facility grows or changes, the cooling system can be modified without the need for extensive renovations or replacements. The MCS can be installed in various configurations, further enhancing its versatility.

The technology behind the HP MCS includes advanced cooling methods such as direct evaporative cooling and chilled water cooling. Direct evaporative cooling utilizes the principles of evaporative heat exchange to cool air without excessive energy consumption, making it an eco-friendly choice. In contrast, chilled water cooling uses a network of pipes filled with chilled water to remove heat from the server environment efficiently. This combination allows the MCS to adapt to various heat loads and ambient conditions.

Another notable characteristic of the HP Modular Cooling System is its intelligent controls and sensors. These components continually monitor temperature and humidity levels within the data center, automatically adjusting cooling output to maintain optimal conditions. This proactive approach helps to prevent overheating, reduces energy usage, and ensures the longevity of IT equipment.

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The HP Modular Cooling System stands out for its combination of innovative technologies, flexibility, and a commitment to energy efficiency. As data centers continue to evolve, the MCS remains a crucial asset in the pursuit of optimized performance and sustainability, providing a reliable solution to meet the demanding cooling needs of modern IT infrastructure.