Parameter

Packaged system (as

Unpackaged system

Unpackaged CTO system

 

shipped on pallet)

(off pallet, unwrapped)

 

 

 

 

 

Height

2159 mm (85 inches)

2007 mm (79 inches)

2007 mm (79 inches)

Width

914.4 mm (36 inches)

600 mm (23.6 inches)

600 mm (23.6 inches)

 

 

 

 

Depth

1727 mm (68 inches)

1200 mm (47.2 inches)

1200 mm (47.2 inches)

Weight

265 kg (584 lb)1

135 kg (299 lb)2

1042 kg (2297 lb)3

MCS-200 (single rack configuration) physical specifications

 

 

 

 

 

Parameter

Packaged system (as

Unpackaged system

Unpackaged CTO system

 

shipped on pallet)

(off pallet, unwrapped)

 

 

 

 

 

Height

2285 mm (90 inches)

2007 mm (79 inches)

2007 mm (79 inches)

Width

1219 mm (48 inches)

904 mm (35.6 inches)

904 mm (35.6 inches)

 

 

 

 

Depth

1829 mm (72 inches)

1510 mm (59.5 inches)

1510 mm (59.5 inches)

Weight

732 kg (1614 lb)1

478 kg (1054 lb)2

1521 kg (3353 lb)3

MCS-200 expansion rack physical specifications

 

 

 

 

 

Parameter

Packaged system (as

Unpackaged system

Unpackaged CTO system

 

shipped on pallet)

(off pallet, unwrapped)

 

 

 

 

 

Height

2159 mm (85 inches)

2007 mm (79 inches)

2007 mm (79 inches)

Width

914.4 mm (36 inches)

600 mm (23.6 inches)

600 mm (23.6 inches)

 

 

 

 

Depth

1727 mm (68 inches)

1399 mm (55.1 inches)

1399 mm (55.1 inches)

Weight

308 kg (680 lb)1

179 kg (395 lb)2

1222 kg (2694 lb)3

1 Weight for a completely packaged system with unpopulated server rack 2 Weight for an unpackaged system with unpopulated server rack

3 Approximate weight for an unpackaged CTO system (actual weight varies, according to configuration)

If the top shipping bracket interferes with deploying the MCS-200/100, it can be removed. With the top shipping bracket, the total height of the unpackaged system is 2069 mm (81.5 inches).

Electrical specifications

The following table lists the electrical specifications for the MCS-100 unit.

Parameter

Value

Comments

 

 

 

 

Operating voltage

230

VAC +/- 10%, 50 Hz

 

208

VAC +/- 10%, 60 Hz

 

AC line phase

Single

Maximum input current

18 A

Per line cord

Maximum inrush current

200

A

Per line cord

Dropout/hold-up time at

20 ms

minimum line voltage

 

 

 

Transfer time of AC transfer

2 s

 

switch

 

 

 

Circuit breaker rating

LAHJ

 

Per cord

Power factor

> 0.95

At all loads

Ground leakage current

< 19.4 mA

Per line cord

Overview 18

Page 18
Image 18
HP Modular Cooling System manual Electrical specifications

Modular Cooling System specifications

The HP Modular Cooling System (MCS) is a state-of-the-art solution designed to efficiently manage the heat generated by high-density IT environments. As data centers face the ever-increasing demand for processing power, traditional cooling methods often fall short, leading to inefficiencies and raised energy costs. The HP MCS addresses this issue with a scalable, flexible design that optimizes cooling performance while minimizing energy consumption.

One of the main features of the HP Modular Cooling System is its modular architecture, which allows for easy expansion and customization based on the specific needs of a data center. This scalability means that as a facility grows or changes, the cooling system can be modified without the need for extensive renovations or replacements. The MCS can be installed in various configurations, further enhancing its versatility.

The technology behind the HP MCS includes advanced cooling methods such as direct evaporative cooling and chilled water cooling. Direct evaporative cooling utilizes the principles of evaporative heat exchange to cool air without excessive energy consumption, making it an eco-friendly choice. In contrast, chilled water cooling uses a network of pipes filled with chilled water to remove heat from the server environment efficiently. This combination allows the MCS to adapt to various heat loads and ambient conditions.

Another notable characteristic of the HP Modular Cooling System is its intelligent controls and sensors. These components continually monitor temperature and humidity levels within the data center, automatically adjusting cooling output to maintain optimal conditions. This proactive approach helps to prevent overheating, reduces energy usage, and ensures the longevity of IT equipment.

Energy efficiency is further enhanced through the MCS's integration with HP's monitoring and management software. This software analyzes cooling performance trends, providing actionable insights for facility managers, enabling them to make informed decisions regarding cooling strategies. Additionally, the system is designed with environmentally sustainable practices in mind, aligning with global initiatives to reduce carbon footprints and promote green technology.

The HP Modular Cooling System stands out for its combination of innovative technologies, flexibility, and a commitment to energy efficiency. As data centers continue to evolve, the MCS remains a crucial asset in the pursuit of optimized performance and sustainability, providing a reliable solution to meet the demanding cooling needs of modern IT infrastructure.