Recommended plumbing configuration for the MCS-200/100

Typical plumbing components for an MCS-200/100 configuration

Item

Description

Specifications

 

 

 

1

Chilled water return line

Pipe: 31.75-mm (1.25-inch), ASTM B 88, Type L, hard-drawn copper

 

 

Fittings: ASTM B16.22 Wrought copper

 

 

Solder: ASTM B 32, 95-5 Tin Antimony

 

 

Thread sealant: seal and assemble according to local materials and

 

 

practices

 

 

 

2

Flow/measurement

Valve type: 31.75-mm (1.25-inch) bronze balancing valve, ball design,

 

balancing valve

with positive shutoff, integral checked metering ports, adjustable knob,

 

 

memory device, calibrated nameplate, integral drain port, and solder

 

 

end connections

 

 

Position: horizontal run of pipe

 

 

Orient drain port toward MCS-200/100. Avoid fittings closer to

 

 

measurement valve than five pipe diameters upstream and two pipe

 

 

diameters downstream for maximum performance.

 

 

Watts CSM-61 or equivalent, typical 1

 

 

 

3

Pipe

31.75 mm (1.25 inches) copper, male (NPT or BSPP) adapter to

 

 

connect the MCS-200/100 water hoses, typical 2

4

Isolation valves

Valve type: 31.75-mm (1.25-inch), two-piece, full-port, brass ball valve,

 

 

with chrome plated brass ball, PTFE seats, steel handle, with female

 

 

connections and 31.75-mm (1.25-inch) bushing on the end toward

 

 

MCS-200/100 hoses.

 

 

Pressure rating: 600 psi WOG, 150 psi WSP

 

 

Watts FBV-3C or equivalent

 

 

 

5

Chilled water supply

Pipe: 31.75-mm (1.25-inch), ASTM B 88, Type L, hard-drawn copper

 

line

Fittings: ASTM B16.22 Wrought copper

 

 

Solder: ASTM B 32, 95-5 Tin Antimony

 

 

Thread sealant: Seal and assemble according to local materials and

 

 

practices

 

 

 

Facility planning for implementation 68

Page 68
Image 68
HP Modular Cooling System manual Fittings Astm B16.22 Wrought copper

Modular Cooling System specifications

The HP Modular Cooling System (MCS) is a state-of-the-art solution designed to efficiently manage the heat generated by high-density IT environments. As data centers face the ever-increasing demand for processing power, traditional cooling methods often fall short, leading to inefficiencies and raised energy costs. The HP MCS addresses this issue with a scalable, flexible design that optimizes cooling performance while minimizing energy consumption.

One of the main features of the HP Modular Cooling System is its modular architecture, which allows for easy expansion and customization based on the specific needs of a data center. This scalability means that as a facility grows or changes, the cooling system can be modified without the need for extensive renovations or replacements. The MCS can be installed in various configurations, further enhancing its versatility.

The technology behind the HP MCS includes advanced cooling methods such as direct evaporative cooling and chilled water cooling. Direct evaporative cooling utilizes the principles of evaporative heat exchange to cool air without excessive energy consumption, making it an eco-friendly choice. In contrast, chilled water cooling uses a network of pipes filled with chilled water to remove heat from the server environment efficiently. This combination allows the MCS to adapt to various heat loads and ambient conditions.

Another notable characteristic of the HP Modular Cooling System is its intelligent controls and sensors. These components continually monitor temperature and humidity levels within the data center, automatically adjusting cooling output to maintain optimal conditions. This proactive approach helps to prevent overheating, reduces energy usage, and ensures the longevity of IT equipment.

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The HP Modular Cooling System stands out for its combination of innovative technologies, flexibility, and a commitment to energy efficiency. As data centers continue to evolve, the MCS remains a crucial asset in the pursuit of optimized performance and sustainability, providing a reliable solution to meet the demanding cooling needs of modern IT infrastructure.