
Intel® 80219 General Purpose PCI Processor
8.Vih Minimum Input High Voltage (Vih) level for the PCI pins
| Problem: | The Vih Minimum Input High Voltage (Vih) level for the PCI pins is being tested at 100 mV higher | 
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 | than the minimum Vih level specified in Table  | 
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 | PCI Local Bus Specification, Revision 2.2. This Vih test limit only applies to cold temperature | 
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 | testing specified to be 0°C. | 
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 | The PCI Local Bus Specification, Revision 2.2 specifies the minimum Vih level to be 0.5 Vcc. The | 
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 | Vcc specification is 3.3 V +/- 10% with the minimum Vcc specification (or minimum power level) | 
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 | being tested at 3.0 V. The minimum Vih level per the PCI Specification should therefore be | 
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 | 0.5(3.0 V) or 1.5 V. The 80219 is unable to meet this minimum Vih level at cold temperature | 
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 | testing specified to be 0°C. | 
| Implication: | During cold temperature manufacturing testing, 80219 silicon is subjected to a 0°C environment | 
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 | for an extended period of time. During this time the Vih test is implemented and the junction | 
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 | temperature is at or near the test temperature of 0°C. This junction temperature is considered to be | 
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 | far less than the temperature the 80219 silicon would be subjected to in a customer application | 
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 | under operating conditions. | 
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 | Below is an example calculation showing the expected junction temperature for a customer | 
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 | application operating in an ambient temperature of 0°C: | 
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 | Tj = junctions temperature, Ta = ambient temperature, qja = junction to ambient thermal | 
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 | resistance of the package, P = power at minimum Vcc | 
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 | Tj = Ta + (qja * P) where Ta = 0C, qja = 13.94 C/W assuming 200lfm airflow (see Table 11 of | 
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 | the Intel® 80219 General Purpose PCI Processor Datasheet), P = 3.0 W | 
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 | Tj = 0 + (13.94 C/W * 3.0 C) | 
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 | Tj = 41.82 C | 
| Workaround: | The minimum Vih level for the PCI pins will be tested at the PCI Local Bus Specification, | 
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 | Revision 2.2 specification (0.5 Vcc) plus an additional 100 mV that equates to 1.6 V during cold | 
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 | temperature manufacturing testing. | 
| Status: | NoFix. | 
| Specification Update | 23 | 
