Intel® 80219 General Purpose PCI Processor
8.Vih Minimum Input High Voltage (Vih) level for the PCI pins
Problem: | The Vih Minimum Input High Voltage (Vih) level for the PCI pins is being tested at 100 mV higher |
| than the minimum Vih level specified in Table |
| PCI Local Bus Specification, Revision 2.2. This Vih test limit only applies to cold temperature |
| testing specified to be 0°C. |
| The PCI Local Bus Specification, Revision 2.2 specifies the minimum Vih level to be 0.5 Vcc. The |
| Vcc specification is 3.3 V +/- 10% with the minimum Vcc specification (or minimum power level) |
| being tested at 3.0 V. The minimum Vih level per the PCI Specification should therefore be |
| 0.5(3.0 V) or 1.5 V. The 80219 is unable to meet this minimum Vih level at cold temperature |
| testing specified to be 0°C. |
Implication: | During cold temperature manufacturing testing, 80219 silicon is subjected to a 0°C environment |
| for an extended period of time. During this time the Vih test is implemented and the junction |
| temperature is at or near the test temperature of 0°C. This junction temperature is considered to be |
| far less than the temperature the 80219 silicon would be subjected to in a customer application |
| under operating conditions. |
| Below is an example calculation showing the expected junction temperature for a customer |
| application operating in an ambient temperature of 0°C: |
| Tj = junctions temperature, Ta = ambient temperature, qja = junction to ambient thermal |
| resistance of the package, P = power at minimum Vcc |
| Tj = Ta + (qja * P) where Ta = 0C, qja = 13.94 C/W assuming 200lfm airflow (see Table 11 of |
| the Intel® 80219 General Purpose PCI Processor Datasheet), P = 3.0 W |
| Tj = 0 + (13.94 C/W * 3.0 C) |
| Tj = 41.82 C |
Workaround: | The minimum Vih level for the PCI pins will be tested at the PCI Local Bus Specification, |
| Revision 2.2 specification (0.5 Vcc) plus an additional 100 mV that equates to 1.6 V during cold |
| temperature manufacturing testing. |
Status: | NoFix. |
Specification Update | 23 |
