Mobile Intel® 915GME Express Chipset —Getting Started
Mobile Intel® 915GME Express Chipset
Development Kit User’s Manual April 2007
14 Order Number: 317230-001US
2.0 Getting Started
This chapter identifies the evaluation kit’s key components, features and specifications.
It also details basic board setup and operation.

2.1 Overview

The evaluation board consists of a baseboard populated with the Mobile Intel® 915GME
Express Chipset , other system board components, and peripheral connectors.
Note: The evaluation board is shipped as an open system allowing for maximum flexibility in
changing hardware configuration and peripherals. Since the board is not in a protective
chassis, take extra precaution when handling and operating the system.

2.1.1 Mobile Intel® 915GME Express Chipset Features

Features of the development kit board are summarized below:
Processor
•Supports Intel
® Pentium® M Processor with 2 MByte L2 Cache on 90 nm process in
the 478 pin Flip Chip Pin Grid Array (Micro-FCPGA) package
— Supported processors are the Intel® Pentium® M 760 Processor and the Intel®
Pentium® M 738 Processor
•Supports Intel
® Celeron® M Processor on 90 nm process in the 478 pin Flip Chip
Pin Grid Array (Micro-FCPGA) package
— Supported processors are the Intel® Celeron® M 370 Processor and the Intel®
Celeron® M 373 Processor
Note: This reference platform does not support the Intel® Pentium® M 745 Processor.
Mobile Intel® 915GME Express Graphics Memory Controller Hub (915GME
Express GMCH)
• 1257 pin Micro-FCBGA Package
• Supports a 400/533 MHz front side bus
• Dual-Channel DDR2 at 400/533 MHz
• Two SODIMM slots (one per channel) support DDR2 SODIMMS (unbuffered, non-
ECC) modules
• Supports 128 MBytes to 2 GBytes using 256 Mbit, 512 Mbit, or 1 Gbit technology
• x16 PCI Express Graphics or Serial Digital Video Out (SDVO) port
• LVDS, VGA support
I/O Controller Hub 6 (ICH6-M)
• 609 pin plastic BGA package
• DMI (x4) interface with GMCH