Mobile Intel® 915GME Express Chipset
Figure 7. Back Plate Pins
Back plate pins
4.Clean the die of the processor with isopropyl alcohol before the heat sink is attached to the processor. This ensures that the surface of the die is clean.
5.Place the heat sink over the pins of the heat sink back plate. Slide the heat sink over the lugs on the back plate pins so that the base is directly over the processor die. Turn the heat sink clockwise until it contacts the die. Then turn the heat sink ¼ turn to tighten it. The heat sink should be snug but not tight.
Caution: Overtightening the heat sink could cause excessive pressure on the die and damage the processor.
6.Plug the fan connector for the heat sink onto the CPU fan header on the motherboard.
Mobile Intel® 915GME Express Chipset |
|
Development Kit User’s Manual | April 2007 |
52 | Order Number: |
