Intel Desktop Board D810EMO/MO810E Technical Product Specification

Table 37 provides maximum component case temperatures for board components that could be sensitive to thermal changes. Case temperatures could be affected by the operating temperature, current load, or operating frequency. Maximum case temperatures are important when considering proper airflow to cool the board.

Table 37. Thermal Considerations for Components

Component

Maximum Case Temperature

Intel Celeron Processor

 

366 MHz

85 °C

400 MHz

85 °C

433 MHz

85 °C

466 MHz

70 °C

500 MHz

70 °C

533 MHz

70 °C

Intel Pentium III Processor

 

500E MHz

85 °C

550E MHz

85 °C

600E MHz

85 °C

600EB MHz

85 °C

Intel 82810E DC-133 GMCH

70 °C

Intel 82801AA ICH

100 °C

Creative ES1373D

70 °C

CAUTION

The voltage regulator area can reach a temperature of up to 85 oC in an open chassis. Ensure that there is proper airflow to this area of the board. Failure to do so may result in damage to the voltage regulator circuit. System integrators should ensure that proper airflow is maintained in the voltage regulator circuit (item E in Figure 10). Components in this area could be damaged without adequate airflow.

2.13 Reliability

The mean time between failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate repair rates and spare parts requirements.

The Mean Time Between Failures (MTBF) data is calculated from predicted data at 55 ºC.

Board MTBF: 330,526 hours

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