Intel Desktop Board D810EMO/MO810E Technical Product Specification
Table 37 provides maximum component case temperatures for board components that could be sensitive to thermal changes. Case temperatures could be affected by the operating temperature, current load, or operating frequency. Maximum case temperatures are important when considering proper airflow to cool the board.
Table 37. Thermal Considerations for Components
Component | Maximum Case Temperature |
Intel Celeron Processor |
|
366 MHz | 85 °C |
400 MHz | 85 °C |
433 MHz | 85 °C |
466 MHz | 70 °C |
500 MHz | 70 °C |
533 MHz | 70 °C |
Intel Pentium III Processor |
|
500E MHz | 85 °C |
550E MHz | 85 °C |
600E MHz | 85 °C |
600EB MHz | 85 °C |
Intel 82810E | 70 °C |
Intel 82801AA ICH | 100 °C |
Creative ES1373D | 70 °C |
CAUTION
The voltage regulator area can reach a temperature of up to 85 oC in an open chassis. Ensure that there is proper airflow to this area of the board. Failure to do so may result in damage to the voltage regulator circuit. System integrators should ensure that proper airflow is maintained in the voltage regulator circuit (item E in Figure 10). Components in this area could be damaged without adequate airflow.
2.13 Reliability
The mean time between failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction Procedure,
The Mean Time Between Failures (MTBF) data is calculated from predicted data at 55 ºC.
Board MTBF: 330,526 hours
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