Installing Memory

The SHG2 Server Board contains six 184-pin DIMM sockets. Memory is partitioned as three banks. DIMMs must be populated in identical pairs.

 

3B

2B

3A

2A

1B

 

1A

OM14558

Figure 6. DIMM Locations

The SHG2 server board supports up to six 2.5 V, ECC, DDR 200 or 266-compliant, registered SDRAM 184-pin gold DIMMs. A wide range of DIMM sizes are supported, including 128 MB, 256 MB, 512 MB, 1 GB, and 2 GB DIMMs. The minimum supported memory configuration is 256 MB, using two identical 128 MB DIMMs. The maximum configurable memory size is 12 GB using six 2 GB DIMMs.

The SDRAM interface runs at 200 MHz; however 266 MHz memory can be used. The memory controller supports 2-way interleaved SDRAM, memory scrubbing, single-bit error correction and multiple-bit error detection with Chipkill capability that allows the system to continue to run even in the event of a multi-bit SDRAM failure. Memory can be implemented with either single-sided (one row) or double-sided (two row) DIMMs.

NOTE

Use DIMMs that have been tested for compatibility with the server board. Contact your sales representative or dealer for a current list of approved memory modules. Check the Intel Customer Support website for the latest tested memory list:

http://support.intel.com/support/motherboards/server/SHG2

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Intel Server Board SHG2 Product Guide

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Intel SHG2 manual Installing Memory, Dimm Locations

SHG2 specifications

Intel SHG2, short for Server High-Performance GPU 2, represents a significant evolution in graphics technology designed to meet the demanding requirements of data centers and high-performance computing applications. Developed to support a range of workloads, SHG2 is particularly optimized for artificial intelligence, machine learning, and data analytics.

One of the defining features of the Intel SHG2 is its impressive processing power. With numerous cores capable of parallel processing, it can execute multiple tasks simultaneously, leading to faster computation times. This architecture makes it incredibly efficient for applications that require heavy calculations and real-time data processing.

The SHG2 also embraces advanced fabrication technologies, moving to smaller nodes that enhance power efficiency while delivering higher performance. These innovations not only allow for improved thermal management but also contribute to the reduction of overall energy consumption, making the SHG2 a more environmentally friendly choice for server operations.

In terms of memory support, the SHG2 offers a robust configuration, accommodating high-bandwidth memory (HBM) that ensures quick access to critical data. This feature is essential for applications needing rapid data retrieval and integration, such as deep learning models where every millisecond counts.

Moreover, the SHG2 is built with compatibility in mind. It integrates seamlessly with existing Intel architectures, allowing organizations to leverage their current investments while upgrading their processing capabilities. This compatibility makes it easier for businesses to enhance their infrastructure without undergoing a complete overhaul of their systems.

Another salient characteristic of the Intel SHG2 is its support for virtualization. This allows multiple workloads to be handled simultaneously on a single GPU, maximizing resource utilization and enhancing overall system performance. As enterprises increasingly adopt cloud-based solutions, the ability to virtualize GPU resources becomes critical.

Security is also a major consideration in the design of the SHG2. Intel has incorporated various security features to ensure that data is protected against unauthorized access and vulnerabilities that could threaten system integrity.

As businesses increasingly turn to AI and machine learning to drive innovation, the Intel SHG2 positions itself as an essential tool for those looking to harness the power of advanced computing. With its impressive features, powerful performance, and forward-thinking design, is a strategic choice for organizations aiming to enhance their computational capabilities and meet the challenges of tomorrow's technological landscape.