23

Appendix C – FPGA Pinout

FPGA Pinout

50MHZ_CLOCK

AA14

50 MHz Clock In +/‐ 50 ppm

I

LV_TTL 3.3V

50MHZ_CLOCK

AB12

50 MHz Clock In +/‐ 50 ppm

I

LV_TTL 3.3V

50MHZ_CLOCK

AB14

50 MHz Clock In +/‐ 50 ppm

I

LV_TTL 3.3V

50MHZ_CLOCK

AC13

50 MHz Clock In +/‐ 50 ppm

I

LV_TTL 3.3V

50MHZ_CLOCK

AD15

50 MHz Clock In +/‐ 50 ppm

I

LV_TTL 3.3V

50MHZ_CLOCK

AE13

50 MHz Clock In +/‐ 50 ppm

I

LV_TTL 3.3V

ADC_AMP_PWUP

AD14

A/D Amplifier Power Up

O

LV_TTL 3.3V

ADC_CLK

V23

Clock

O

LV_CMOS 2.5V

ADC_D0

W23

Data 0 [LSB]

I

LV_CMOS 2.5V

ADC_D1

T24

Data 1

I

LV_CMOS 2.5V

ADC_D2

V21

Data 2

I

LV_CMOS 2.5V

ADC_D3

W18

Data 3

I

LV_CMOS 2.5V

ADC_D4

Y22

Data 4

I

LV_CMOS 2.5V

ADC_D5

W20

Data 5

I

LV_CMOS 2.5V

ADC_D6

AB21

Data 6

I

LV_CMOS 2.5V

ADC_D7

Y18

Data 7

I

LV_CMOS 2.5V

ADC_D8

AB20

Data 8

I

LV_CMOS 2.5V

ADC_D9

AC21

Data 9

I

LV_CMOS 2.5V

ADC_D10

T20

Data 10

I

LV_CMOS 2.5V

ADC_D11

R20

Data 11

I

LV_CMOS 2.5V

ADC_D12

R21

Data 12

I

LV_CMOS 2.5V

ADC_D13

V18

Data 13 [MSB]

I

LV_CMOS 2.5V

ADC_MODE

T17

Data Format Select

O

LV_CMOS 2.5V

ADC_OTR

T18

Out‐of‐Range Indicator

O

LV_CMOS 2.5V

ADC_PDWN

V22

Power Down A/D Controller

O

LV_CMOS 2.5V

CB_CAD0

K3

CardBus Data/Address 0

I/O

LV_TTL 3.3V

CB_CAD1

F3

CardBus Data/Address 1

I/O

LV_TTL 3.3V

CB_CAD2

D3

CardBus Data/Address 2

I/O

LV_TTL 3.3V

CB_CAD3

C3

CardBus Data/Address 3

I/O

LV_TTL 3.3V

CB_CAD4

M6

CardBus Data/Address 4

I/O

LV_TTL 3.3V

CB_CAD5

L7

CardBus Data/Address 5

I/O

LV_TTL 3.3V

CB_CAD6

K7

CardBus Data/Address 6

I/O

LV_TTL 3.3V

CB_CAD7

J4

CardBus Data/Address 7

I/O

LV_TTL 3.3V

CB_CAD8

G5

CardBus Data/Address 8

I/O

LV_TTL 3.3V

CB_CAD9

G9

CardBus Data/Address 9

I/O

LV_TTL 3.3V

CB_CAD10

F7

CardBus Data/Address 10

I/O

LV_TTL 3.3V

CB_CAD11

F8

CardBus Data/Address 11

I/O

LV_TTL 3.3V

CB_CAD12

D4

CardBus Data/Address 12

I/O

LV_TTL 3.3V

CB_CAD13

C4

CardBus Data/Address 13

I/O

LV_TTL 3.3V

CB_CAD14

D5

CardBus Data/Address 14

I/O

LV_TTL 3.3V

E‐14 Hardware Reference Manual

www.picocomputing.com

 

Pico Computing, Inc.

Page 23
Image 23
Pico Communications E-14 manual Appendix C Fpga Pinout

E-14 specifications

Pico Communications E-14 is an advanced wireless communication device designed to meet the demands of modern connectivity. As a versatile solution, it serves various applications in sectors such as telecommunications, IoT, and smart cities. The E-14 stands out for its compact design, exceptional performance, and robust feature set that cater to both individual users and enterprises.

One of the primary features of the Pico E-14 is its support for multiple communication protocols, including LTE, NB-IoT, and LoRaWAN. This multi-protocol capability ensures that users can select the most suitable option for their specific use case, whether it be high-speed data transfer or low-power wide-area networking. With seamless integration into existing infrastructure, the E-14 facilitates hassle-free deployments.

Power efficiency is another hallmark of the Pico E-14. Designed for longevity, the device includes intelligent power management features that drastically reduce energy consumption, making it an ideal choice for battery-operated devices and remote monitoring applications. This capability is particularly valuable in settings where maintenance access is limited, and downtime must be minimized.

The E-14’s built-in security features provide enhanced data protection, making it suitable for applications that require confidentiality and integrity. With end-to-end encryption, secure boot, and trusted platform modules, users can rest assured that their data remains protected against unauthorized access and cyber threats.

Moreover, the Pico E-14 boasts a user-friendly interface, which simplifies setup and operation. Its intuitive configuration tools allow users to quickly adjust settings and monitor performance metrics, reducing the need for specialized technical knowledge. This ease of use is a significant advantage in environments where teams may vary in technical expertise.

The device is also rugged and built to withstand harsh environmental conditions. Its robust casing protects against dust, moisture, and extreme temperatures, allowing it to function reliably in a variety of settings, from urban installations to remote field deployments.

With its array of features, the Pico Communications E-14 is well-positioned to play a pivotal role in the evolution of connectivity solutions. By offering flexible communication methods, energy efficiency, enhanced security, and user-friendly functionality, it addresses the complexities of modern communication needs while paving the way for innovative applications in the future.