Samsung DDR3 manual 78 + 4Ball Fbga for 1Gb D-die x4/x8, Bottom Top Support Ball

General Information DDR3 SDRAM

78 + 4Ball FBGA for 1Gb D-die (x4/x8)

9.00 ±

0.10

#A1 INDEX MARK

0.10MAX

0.80 x 10 = 8.00

A

(Datum A)

0.80

1.60

4.00

#A1

9.00 ± 0.10

11 10

9

8

7

6

5

4

3

2

1

B

A

B

(Datum B)

C

4.80

D

0.80

9.60=

0.10

0.10

0.05±

E

F

G

0.80x 12

11.00±

11.00±

0.50

H

J

K

0.80

L

M

N

0.35 ± 0.05

(0.95)

82 - ∅0.45 Solder ball

MOLDING AREA

(Post Reflow ∅0.05 ± 0.05)

1.10 ± 0.10

(1.90)

0.2

M A B

Bottom

Top

: Support Ball

96 + 4Ball FBGA for 1Gb D-die (x16)

9.00 ± 0.10

A

0.10MAX

0.80 x 10 = 8.00

0.80

1.60

4.00

#A1 INDEX MARK

#A1

9.00 ± 0.10

11 10

9

8

7

6

5

4

3

2

1

B

(Datum A)

A

B

C

D

0.40

6.00

=15x0.8012.00

13.30±0.10

13.30±0.10

0.50± 0.05

(Datum B)

L

E

F

H

J

K

M

N

0.80

P

R

T

100 - ∅0.45 Solder ball

(0.95)

0.35 ± 0.05

MOLDING AREA

(Post Reflow ∅0.05 ± 0.05)

1.10 ± 0.10

(1.90)

0.2

M A B

Top

Bottom

: Support Ball

October 2009