General Information | DDR3 SDRAM |
78Ball DDP for 1Gb D-die (x4)
(Datum A)
A
B
C
(Datum B) D
E
F
G
H
J
K
L
M
N
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| 10.50 | ± 0.10 |
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| x 8 = |
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| 0.80 | 6.40 |
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| #A1 INDEX MARK |
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| 1.60 | 4.00 |
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| 0.80 |
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| #A1 |
9 | 8 | 7 | 6 | 5 | 4 | 3 | 2 | 1 | B |
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| 4.80 |
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| 0.80 |
| 9.60 |
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| x 12 |
| 11.00 ± |
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| 0.80 |
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| 0.80 |
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10.50 ± 0.10
11.00 ± 0.10
0.10MAX
82- ∅0.45 Solder ball (Post Reflow ∅0.50 ± 0.05)
0.2 M A B
Bottom
Top
0.35 ± 0.05
1.40 ± 0.10
78Ball DDP for 1Gb E-die (x4/x8)
(Datum A)
A
B
C
(Datum B) D
E
F
G
H
J
K
L
M
N
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| 9.00 ± 0.10 |
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| A | ||||
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| 0.80 x 8 = 6.40 |
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| #A1 INDEX MARK | |||||
| 0.80 |
| 1.60 |
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| 3.20 |
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| #A1 | ||||
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9 | 8 | 7 | 6 | 5 | 4 | 3 | 2 | 1 | B |
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| 4.80 |
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| 0.80 |
| 9.60 |
| 0.10 | ||||||
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| x 12 |
| 11.50 ± |
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| 0.80 |
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| 0.80 |
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9.00 ± 0.10
11.50 ± 0.10
0.10MAX
78- ∅0.45 Solder ball (Post Reflow ∅0.50 ± 0.05)
0.2 M A B
Bottom
Top
0.35± 0.05
1.40± 0.10
October 2009
