General Information

 

 

 

 

 

 

 

 

DDR3 SDRAM

1. DDR3 SDRAM Component Ordering Information

 

 

 

1

2

3

4

5

6

7

8

9

10

11

K 4 B X X X X X X X - X X X X

SAMSUNG Memory

DRAM

DRAM Type

Density

Bit Organization

1.SAMSUNG Memory : K

2.DRAM : 4

3.DRAM Type

B: DDR3 SDRAM

4.Density

51 : 512Mb

1G : 1Gb

2G : 2Gb

4G : 4Gb

5. Bit Organization

04 : x 4

08 : x 8

16 : x16

6. # of Internal Banks

3: 4 Banks

4: 8 Banks

5: 16 Banks

Speed

Temp & Power

Package Type

Revision

Interface (VDD, VDDQ)

# of Internal Banks

7.Interface ( VDD, VDDQ) 6 : SSTL (1.5V, 1.5V)

8.Revision

M: 1st Gen.

A: 2nd Gen.

B: 3rd Gen.

C: 4th Gen.

D: 5th Gen.

E: 6th Gen.

F: 7th Gen

G: 8th Gen

H: 9th Gen

9.Package Type

Z: FBGA (Lead-free)

H: FBGA (Halogen-free & Lead-free) J : FBGA (Lead-free, DDP)

M : FBGA (Halogen-free & Lead-free, DDP)

10.Temp & Power

C : Commercial Temp.( 0°C ~ 85°C) & Normal Power

L : Commercial Temp.( 0°C ~ 85°C) & Low Power

Y : Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V)

11.Speed

F7 : DDR3-800 (400MHz @ CL=6, tRCD=6, tRP=6)

F8 : DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7)

H9 : DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9)

K0 : DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11)

October 2009

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