General Information | DDR3 SDRAM |
78Ball DDP for 2Gb B-die (x4/x8)
(Datum A)
A
B
C
(Datum B) D
E
F
G
H
J
K
L
M
N
|
| 10.00 | ± 0.10 |
|
| A | |||
|
| 0.80 x 8 = 6.40 |
|
| |||||
|
|
|
| #A1 INDEX MARK | |||||
| 0.80 |
| 1.60 |
|
| 3.20 |
| ||
|
|
|
|
| #A1 | ||||
|
|
|
|
|
|
|
|
| |
9 | 8 | 7 | 6 | 5 | 4 | 3 | 2 | 1 | B |
|
| 4.80 |
|
|
|
| |||||
| 0.80 |
| 9.60 |
| 0.10 | ||||||
|
| ||||||||||
|
|
|
|
|
| = |
|
| |||
|
|
|
|
|
|
|
|
| x 12 |
| 11.50 ± |
|
|
|
|
|
|
|
| ||||
|
|
|
|
|
|
|
|
| 0.80 |
| |
|
|
|
| 0.80 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
10.00 ± 0.10
11.50 ± 0.10
0.10MAX
78- ∅0.45 Solder ball (Post Reflow ∅0.50 ± 0.05)
0.2 M A B
Bottom
Top
0.35± 0.05
1.40± 0.10
October 2009
