Samsung DDR3 manual Bottom Top 96Ball Fbga for 1Gb E-die

General Information DDR3 SDRAM

78Ball FBGA for 1Gb E-die (x4/x8) / 1Gb F-die (x4/x8) / 2Gb C-die (x4/x8)

7.50 ± 0.10

A

0.10MAX

0.80 x 8 = 6.40

#A1 INDEX MARK

(Datum A)

0.80 1.60

3.20

#A1

7.50 ± 0.10

9

8

7

6

5

4

3

2

1

B

A

B

(Datum B)

C

4.80

D

= 9.60

± 0.05

E

0.80

0.10

0.10

F

G

0.80 x 12

11.00 ±

11.00 ±

0.50

H

J

K

0.80

L

M

N

0.35 ± 0.05

(0.95)

78 - ∅0.45 Solder ball

MOLDING AREA

(Post Reflow ∅0.05 ± 0.05)

1.10 ± 0.10

(1.90)

0.2

M

A B

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96Ball FBGA for 1Gb E-die (x16)

7.50 ± 0.10

A

0.10MAX

0.80 x 8 = 6.40

0.80 1.60

3.20

#A1 INDEX MARK

7.50 ± 0.10

#A1

9

8

7

6

5

4

3

2

1

B

(Datum A)

A

B

C

D

6.00

(Datum B)

E

0.50 ± 0.05

F

0.40

0.80 x 15 = 12.00

13.30 ± 0.10

13.30 ± 0.10

G

H

J

K

L

M

N

0.80

P

R

T

96 - ∅0.45 Solder ball

(0.95)

0.35 ± 0.05

MOLDING AREA

(Post Reflow ∅0.05 ± 0.05)

1.10 ± 0.10

(1.90)

0.2

M

A B

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October 2009