Samsung DDR3 manual 96Ball Fbga for 2Gb B-die, 78Ball Fbga for 2Gb B-die x4/x8

General Information DDR3 SDRAM

78Ball FBGA for 2Gb B-die (x4/x8)

9.00 ± 0.10

A

0.10MAX

(Datum A)

0.80

1.60

3.20

#A1 INDEX MARK

#A1

9.00 ± 0.10

9

8

7

6

5

4

3

2

1

B

A

B

(Datum B)

C

4.80

D

= 9.60

F

0.80

0.10

0.10

G

0.80 x 12

11.50 ±

11.50 ±

H

J

K

0.80

L

M

N

0.35 ± 0.05

(0.95)

78 - ∅0.45 Solder ball

MOLDING AREA

(Post Reflow ∅0.50 ± 0.05)

1.10 ± 0.10

(1.90)

0.2

M

A B

BOTTOM VIEW

TOP VIEW

96Ball FBGA for 2Gb B-die (x16)

9.00 ± 0.10

A

0.80

1.60

3.20

#A1 INDEX MARK

#A1

9.00 ± 0.10

B

9

8

7

6

5

4

3

2

1

(Datum A)

A

B

D

6.00

(Datum B)

E

F

0.40

= 12.00

0.10

0.10

H

0.80x 12

13.30±

13.30±

J

L

K

M

N

0.80

P

R

T

96 - ∅0.45 Solder ball

(0.95)

MOLDING AREA

(Post Reflow ∅0.50 ± 0.05)

(1.90)

0.2

M

A B

BOTTOM VIEW

TOP VIEW

0.10MAX

0.35± 0.05

1.10± 0.10

October 2009