Seagate ST400FX0012, ST100FX0002, ST200FX0002, ST400FX0002 manual Cooling, Air flow

10.2Cooling

Cabinet cooling must be designed by the customer so that the temperature of the drive will not exceed temper- ature conditions specified in Section 7.5.1, "Temperature."

The rack, cabinet, or drawer environment for the drive must provide heat removal from the assembly. The sys- tem designer should confirm that adequate heat removal is provided using the temperature measurement guidelines described in Section 7.5.1.

Forced air flow may be required to keep temperatures at or below the temperatures specified in Section 7.5.1 in which case the drive should be oriented, or air flow directed, so that the least amount of air flow resistance is created while providing air flow. Also, the shortest possible path between the air inlet and exit should be cho- sen to minimize the travel length of air heated by the drive and other heat sources within the rack, cabinet, or drawer environment.

If forced air is determined to be necessary, possible air-flow patterns are shown in Figure 13. The air-flow pat- terns are created by one or more fans, either forcing or drawing air as shown in the illustrations. Conduction, convection, or other forced air-flow patterns are acceptable as long as the temperature measurement guide- lines of Section 7.5.1 are met.

Note. Air flows in the direction shown (back to front) or in reverse direction (front to back)

Above unit

Under unit

Note. Air flows in the direction shown or in reverse direction (side to side)

Figure 13. Air flow

Above unit

Under unit

Note. Image may not represent actual product, for reference only.

42 Pulsar XT.2 SAS Product Manual, Rev. B