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5-3. NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS

Note on Printed Wiring Boards:

•X: parts extracted from the component side.

•Y: parts extracted from the conductor side.

• : Pattern from the side which enables seeing. (The other layers' patterns are not indicated.)

Caution:
Pattern face side:	Parts on the pattern face side seen from
(Conductor Side)	the pattern face are indicated.
Parts face side:	Parts on the parts face side seen from
(Component Side)	the parts face are indicated.

•MAIN board and SUB board are six-layer printed boards. However, the patterns of layers 2 to 5 have not been included in these diagrams.

*Replacement of C5000, IC5600, IC7001and IC8000 used in this set requires a special tool.

•Lead Layouts

Lead layout of conventional IC

CSP (chip size package)

Note on Schematic Diagram:

•All capacitors are in ∝ F unless otherwise noted. pF: ∝∝ F 50 WV or less are not indicated except for electrolytics and tantalums.

•All resistors are in Ω and 1/4 W or less unless otherwise specified.

•% : indicates tolerance.

•A : B+ Line.

•Power voltage is dc 1.2 V and fed with regulated dc power supply from battery terminal.

•Voltages and waveforms are dc with respect to ground under no-signal conditions.

•no mark : PLAYBACK

(	) : when USB connection

•Voltages are taken with a VOM (Input impedance 10 MΩ ). Voltage variations may be noted due to normal produc- tion tolerances.

•Waveforms are taken with a oscilloscope.

Voltage variations may be noted due to normal produc- tion tolerances.

•Circled numbers refer to waveforms.

•Signal path.

*Replacement of IC5000, IC5600, IC7001and IC8000 used in this set requires a special tool.

•The voltage and waveform of CSP (chip size package) cannot be measured, because its lead layout is different form that of conventional IC.

Sony NW-MS6 service manual Surface