Texas Instruments TPA701 3.3.1Installing and Removing EVM Boards, 3.3.1.1EVM Insertion, Details

Using The TPA701 MSOP EVM With the Plug-N-Play Evaluation Platform

3.3 Using The TPA701 MSOP EVM With the Plug-N-Play Evaluation Platform

The TPA701 MSOP Audio Amplifier Evaluation Module was designed to be used with the TI Plug-N-Play Audio Amplifier Evaluation Platform. It simply plugs into socket U3 or U4.

The following paragraphs provide additional details for using the TPA701 MSOP EVM with the platform.

3.3.1Installing and Removing EVM Boards

TI Plug-N-Play evaluation modules use single-in-line header pins installed on the underside of the module circuit board to plug into sockets on the platform. The EVM pins and the platform sockets are keyed such that only the correct type of EVM can be installed in a particular socket, and then only with the proper orientation.

Evaluation modules are easily removed from the platform by simply prying them up and lifting them out of their sockets. Care must be taken, however, to prevent bending the pins.

3.3.1.1EVM Insertion

1)Remove all power from the evaluation platform.

2)Locate socket U3 or U4 on the platform.

3)Orient the module correctly.

4)Carefully align the pins of the module with the socket pin receptacles.

5)Gently press the module into place.

6)Check to be sure that all pins are seated properly and that none are bent over.

3.3.1.2EVM Removal

1)Remove all power from the evaluation platform.

2)Using an appropriate tool as a lever, gently pry up one side of the module a small amount.

3)Change to the opposite side of the module and use the tool to pry that side up a small amount.

4)Alternate between sides, prying the module up a little more each time to avoid bending the pins, until it comes loose from the socket.

5)Lift the EVM off of the platform.

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