Texas Instruments manual Description, TPA701 Msop EVM

Description

1.2 Description

The TPA701 MSOP Audio Power Amplifier Evaluation Module is a complete, low-power single-channel audio power amplifier. It consists of the TI TPA701 700-mW Low-Voltage Audio Power Amplifier IC in a very small MSOP package, along with a small number of other parts mounted on a circuit board that is approximately one and a quarter inches square (Figure 1±1).

Figure 1±1. The TI TPA701 Audio Amplifier Evaluation Module

Vdd

Shutdown

S1				+
		R1		²
			U1		C4
	C1
	R2
	C2				R3
					C5

GND

C3

OUT±

GND

OUT+

	TEXAS
	INSTRUMENTS
IN	SLOP213
GND
	TPA701 MSOP EVM

² Due to the very small size of the MSOP IC package, the standard part number TPA701 is replaced with the code TIABA.

Single in-line header pins are mounted to the underside of the module circuit board to allow the EVM to be plugged into the TI Plug-N-Play Audio Amplifier Evaluation Platform or to be wired directly into existing circuits and equipment when used stand-alone.

The platform has room for a pair of TPA701 MSOP evaluation modules and is a convenient vehicle for demonstrating TI's audio power amplifier and related evaluation modules. The EVMs simply plug into the platform, which automatically provides power to the modules, interconnects them correctly, and connects them to a versatile array of standard audio input and output jacks and connectors. Easy-to-use configuration controls allow the platform and EVMs to quickly model many possible end-equipment configurations.

There is nothing to build, nothing to solder, and nothing but the speakers included with the platform to hook up.

Introduction 1-3