VXI Technology, Inc.
COOLING SPECIFICATIONS
COOLING REQUIREMENTS (TBD)
60 W/slot for a 10°C Rise
80 W/slot for a 15°C Rise
AIR FLOW PATH
Air is drawn into the chassis from the rear and is pressurized below the cards. The air is then distributed across all slots along the total length of each slot and is exhausted through the top of the mainframe. When the mainframe is rack mounted, allow approximately 2 inches (50 mm) of clearance at the top and rear for proper airflow.
| 2.5 |
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O | 2.0 |
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2 |
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- mm H | 1.5 |
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Drop | 1.0 |
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Pressure |
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0.5 |
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| 0.0 |
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| 0 | 2.0 | 4.0 | 6.0 | 8.0 |
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| Airflow - Liters/Sec |
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* Covers all slots, unrestricted
FIGURE 1.3 COOLING CAPACITY FOR CT-100B (TYPICAL)
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